SCHEMBL676348

SCHEMBL676348

C[CH]c1cccc(CCCC)c1CCCC

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C9 P11712 1/20 0.38
LIPG Q9Y5X9 1/20 0.37
ALOX5 P09917 1/20 0.37
PTGS2 P35354 1/20 0.37
BID P55957 6/20 0.35
MCL1 Q07820 6/20 0.35
BCL2L1 Q07817 5/20 0.35
BAK1 Q16611 5/20 0.35
KAT8 Q9H7Z6 2/20 0.35
SAE1 Q9UBE0 2/20 0.35
PPARG P37231 1/20 0.35
PPARA Q07869 1/20 0.35
EP300 Q09472 1/20 0.35
KAT2A Q92830 1/20 0.35
KAT2B Q92831 1/20 0.35
KAT5 Q92993 1/20 0.35
TYR P14679 1/20 0.34
MMP2 P08253 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL677265 0.95 LIPG (0.43) LIPGALOX5PTGS2BIDMCL1
SCHEMBL27464370 0.84 LIPG (0.40) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL93496 0.84 CYP3A4 (0.37) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL22572464 0.84 CYP3A4 (0.37) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL2921344 0.82 CYP3A4 (0.45) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL819273 0.82 LIPG (0.45) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL8741681 0.81 THRA (0.41) CYP3A4CYP2D6CYP2C9LIPGALOX5
Ammonia Solution, Strong SCHEMBL9810933 0.80 LIPG (0.44) CYP3A4CYP2D6CYP2C9LIPGALOX5
Water SCHEMBL27341058 0.80 LIPG (0.44) CYP3A4CYP2D6CYP2C9LIPGALOX5
SCHEMBL18568266 0.79 THRA (0.42) LIPGALOX5PTGS2BIDMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9090722-B2 Chemical amplification resist composition, and mold preparation method and resist film using the same FUJIFILM CORPORATION (JP) 2015-07-28 US disclosed
EP-1367439-B1 Radiation-sensitive composition FUJIFILM CORP (JP) 2012-08-01 EP disclosed
US-20120006788-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
EP-2399168-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM Corporation (JP) 2011-12-28 EP disclosed
WO-2010150917-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-12-29 WO disclosed
EP-1467251-B1 Positive resist composition FUJIFILM CORP (JP) 2010-09-08 EP disclosed
EP-1465010-B1 Positive resist composition FUJIFILM CORP (JP) 2009-10-21 EP disclosed
US-20080096130-A1 POSITIVE RESIST COMPOSITION FUJIFILM CORPORATION 2008-04-24 US disclosed
US-7361446-B2 Sensitivity, high resolution, good pattern profile, used for super-microlithography FUJIFILM CORPORATION (JP) 2008-04-22 US disclosed
US-7250246-B2 Positive resist composition and pattern formation method using the same FUJIFILM CORPORATION (JP) 2007-07-31 US disclosed
EP-1367439-A1 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-12-03 EP disclosed
US-6630280-B1 Resin and compound that generates an arylsulfonic acid when exposed to actinic radiation; sensitivity; resolution; smoothness FUJI PHOTO FILM CO., LTD. (JP) 2003-10-07 US disclosed
US-20030134221-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-07-17 US disclosed
US-20030108811-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-06-12 US disclosed
US-20020012866-A1 Positive photoresist composition FUJIFILM CORPORATION (JP) 2002-01-31 US disclosed
US-6207343-B1 RESIN CONTAINING GROUPS WHICH DECOMPOSE BY THE ACTION OF AN ACID TO ENHANCE ITS SOLUBILITY IN AN ALKALINE DEVELOPING SOLUTION AND A COMPOUND WHICH GENERATES AN ACID UPON IRRADIATION WITH ACTINIC RAYS OR RADIATION FUJI PHOTO FILM CO., LTD. (JP) 2001-03-27 US disclosed
EP-0031792-B1 POLYESTER COMPOSITIONS HAVING A REDUCED CORROSIVE EFFECT ON METALS, AND THEIR USE CIBA-GEIGY AG (CH) 1985-07-31 EP disclosed
US-4373044-A REDUCING CORROSIVE ACTION ON METALS OR ALLOYS BY INCLUDING AEROSOL OF AN OXIDE CIBA-GEIGY CORPORATION (US) 1983-02-08 US disclosed
EP-0031792-A2 Polyester compositions having a reduced corrosive effect on metals, and their use CIBA-GEIGY AG (CH) 1981-07-08 EP disclosed
EP-0016722-A1 Stabilised flame-resistant plastics moulding composition and process for stabilising plastics made flame-resistant with organic bromine compounds CIBA-GEIGY AG (CH) 1980-10-01 EP disclosed