⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Crotonaldehyde SCHEMBL8519220 | 0.96 | TRPA1 (1.00) | — | |
| Crotonaldehyde SCHEMBL3482634 | 0.96 | — | — | |
| Crotonaldehyde SCHEMBL38449 | 0.96 | — | — | |
| Crotonaldehyde SCHEMBL38450 | 0.96 | — | — | |
| Crotonaldehyde SCHEMBL254155 | 0.96 | TRPA1 (1.00) | — | |
| Crotonaldehyde SCHEMBL11158005 | 0.92 | — | — | |
| Crotonaldehyde SCHEMBL3111545 | 0.92 | — | — | |
| Crotonaldehyde SCHEMBL11330065 | 0.92 | — | — | |
| Crotonaldehyde SCHEMBL3118858 | 0.92 | — | — | |
| Crotonaldehyde SCHEMBL38651242 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 134 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9464191-B2 | Silicon-containing curing composition and cured product thereof | ADEKA CORPORATION (JP) | 2016-10-11 | — | — | US | claimed |
| EP-4342922-A1 | FLUOROACRYLIC COMPOSITION, FLUOROCHEMICAL ACTINIC-RAY-CURABLE COMPOSITION, AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-03-27 | — | — | EP | disclosed |
| WO-2024053357-A1 | FLUOROPOLYETHER GROUP-CONTAINING COMPOUND, PHOTOCROSSLINKABLE FLUOROPOLYETHER COMPOSITION, PHOTOCROSSLINKED PRODUCT, AND PHOTOCROSSLINKING METHOD OF COMPOSITION | 信越化学工業株式会社 | 2024-03-14 | — | — | WO | disclosed |
| US-11897989-B2 | Fluorine-containing curable composition and article | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-13 | — | — | US | disclosed |
| US-20230064554-A1 | ALKOXYSILYL GROUP-CONTAINING PERFLUOROPOLYETHER COMPOUND, AND COMPOSITION CONTAINING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-03-02 | — | — | US | disclosed |
| US-20220389142-A1 | FLUOROACRYLIC COMPOUND, FLUORINE-CONTAINING ACTINIC-RAY-CURABLE COMPOSITION, AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4095181-A1 | ALKOXYSILYL GROUP-CONTAINING PERFLUOROPOLYETHER COMPOUND, AND COMPOSITION CONTAINING SAME | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-11-30 | — | — | EP | disclosed |
| US-20220220262-A1 | FLUORINE-CONTAINING CURABLE COMPOSITION AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| EP-3603922-B1 | SILICONE MOLD | DAICEL CORP (JP) | 2022-06-15 | — | — | EP | disclosed |
| CN-111819254-B | Curable organopolysiloxane composition, sealant, and semiconductor device | 瓦克化学股份公司 | 2022-06-10 | — | — | CN | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| EP-1852469-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND ITS CURED PRODUCT | Adeka Corporation (JP) | 2007-11-07 | — | — | EP | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |
| US-20030116273-A1 | Method of bonding an optical part | NIPPON SHEET GLASS CO., LTD. (JP) | 2003-06-26 | — | — | US | disclosed |
| EP-1312659-A1 | ADHESIVE COMPOSITION AND OPTICAL DEVICE USING THE SAME | Nippon Sheet Glass Co., Ltd. (JP) | 2003-05-21 | — | — | EP | disclosed |
| US-20030040596-A1 | Optical device and adhesive composition used therefor | NAKAMURA KOICHIRO (JP) | 2003-02-27 | — | — | US | disclosed |
| US-6415093-B1 | RADIATION TRANSPARENT ADHESIVE | NIPPON SHEET GLASS CO., LTD. (JP) | 2002-07-02 | — | — | US | disclosed |
| US-20020074086-A1 | Adhesive composition and optical device using the same | NIPPON SHEET GLASS CO., LTD. (JP) | 2002-06-20 | — | — | US | disclosed |