Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | IDO1 | P14902 | 2/20 | 0.43 |
| ▸ | AGXT | P21549 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 3/20 | 0.36 |
| ▸ | CA2 | P00918 | 3/20 | 0.36 |
| ▸ | CA9 | Q16790 | 3/20 | 0.36 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.36 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.36 |
| ▸ | CA7 | P43166 | 1/20 | 0.36 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.36 |
| ▸ | MAOB | P27338 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22654304 | 0.83 | TSHR (0.48) | TSHRIDO1AGXTALDH1A1CA1 | |
| SCHEMBL22654226 | 0.80 | TSHR (0.45) | TSHRCA1CA2CA9CA7 | |
| SCHEMBL28481426 | 0.76 | IDO1 (0.50) | IDO1LMNAMAOBKMT2A | |
| SCHEMBL675837 | 0.75 | IDO1 (0.45) | TSHRIDO1AGXTALDH1A1ALOX15 | |
| SCHEMBL28472243 | 0.75 | TSHR (0.43) | TSHRIDO1AGXTALDH1A1CA1 | |
| SCHEMBL18297943 | 0.74 | TSHR (0.57) | TSHRIDO1AGXTALDH1A1CA1 | |
| SCHEMBL15848468 | 0.72 | TSHR (0.45) | TSHRIDO1AGXTALDH1A1ALOX15 | |
| SCHEMBL22654136 | 0.71 | MEN1 (0.39) | IDO1CA1CA2CA9HCAR2 | |
| Biphenyl SCHEMBL3673774 | 0.71 | NPSR1 (0.36) | TSHRIDO1AGXTALDH1A1MAPK1 | |
| SCHEMBL20241506 | 0.71 | TSHR (0.54) | TSHRIDO1AGXTALDH1A1ALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111978481-A | Alkali-free water reducing agent and preparation method thereof | 东莞创利科技发展有限公司 | 2020-11-24 | — | — | CN | disclosed |
| CN-104955900-B | Curable composition containing polysiloxane and cured product thereof | 中央硝子株式会社 | 2017-03-15 | — | — | CN | disclosed |
| US-9512272-B2 | Curable composition containing silicone, and cured product thereof | CENTRAL GLASS COMPANY, LIMITED (JP) | 2016-12-06 | — | — | US | disclosed |
| US-20150322211-A1 | Curable Composition Containing Silicone, and Cured Product Thereof | CENTRAL GLASS COMPANY, LIMITED (JP) | 2015-11-12 | — | — | US | disclosed |
| CN-104955900-A | Curable composition containing polysiloxane and cured product thereof | CENTRAL GLASS CO LTD | 2015-09-30 | — | — | CN | disclosed |
| EP-1746132-B1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | ADEKA CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| EP-1801871-B1 | SEMICONDUCTOR DEVICE | KANSAI ELECTRIC POWER CO (JP) | 2012-07-11 | — | — | EP | disclosed |
| CN-1837221-B | Production processes for triorganomonochlorosilanes | HOKKO CHEM IND CO | 2011-06-08 | — | — | CN | disclosed |
| US-7939614-B2 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7772594-B2 | covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20080174016-A1 | Flexible Printed Wiring Board and Semiconductor Device | MITSUI MINING & SMELTING CO., LTD. (JP) | 2008-07-24 | — | — | US | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |
| CN-1296374-C | Method for producing triorgano-monoalkoxysilanes and method for producing triorgano-monochlorosilanes | HOKKO CHEM IND CO (JP) | 2007-01-24 | — | — | CN | disclosed |
| CN-1837221-A | Production processes for triorganomonochlorosilanes | HOKKO CHEM IND CO (JP) | 2006-09-27 | — | — | CN | disclosed |
| CN-1612886-A | Method for producing triorgano-monoalkoxysilanes and method for producing triorgano-monochlorosilanes | HOKKO CHEM IND CO (JP) | 2005-05-04 | — | — | CN | disclosed |