SCHEMBL676463

SCHEMBL676463

CCOC=C[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8052611 0.78
SCHEMBL1407387 0.78
SCHEMBL1407388 0.78
SCHEMBL674290 0.75
SCHEMBL6109145 0.74 CASP1 (0.30)
SCHEMBL352410 0.72
SCHEMBL6275470 0.71
SCHEMBL9577847 0.71
SCHEMBL3904068 0.69
SCHEMBL1285093 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11975984-B2 Surface-treated magnesium hydroxide-comprising material OMYA INTERNATIONAL AG (CH) 2024-05-07 US claimed
US-11919776-B2 Process for preparing waterglass-based silica aerogels and products thereof FUNDACIÓN TECNALIA RESEARCH & INNOVATION (ES) 2024-03-05 US claimed
CN-116496504-A Vinyl-terminated polyborosiloxane filler and preparation method thereof, and organic silicon foam material and preparation method thereof 株洲时代新材料科技股份有限公司 2023-07-28 CN claimed
EP-3927782-A1 AN ANTI-RUST COMPOSITION FOR METAL SURFACE AND A METHOD OF ANTI-RUST TREATMENT ON METAL SURFACE Chemetall GmbH (DE) 2021-12-29 EP claimed
EP-0374495-A2 Polyarylene sulfide moulding compositions with a particular metal adhesion BAYER AG (DE) 1990-06-27 EP claimed
CN-117355632-A Method for producing planarizing film, material for planarizing film, and planarizing film 东曹株式会社 2024-01-05 CN disclosed
CN-115362178-B Vinyl acetate-based copolymer dispersions with small particle size 国际人造丝公司 2023-12-05 CN disclosed
CN-116496504-A Vinyl-terminated polyborosiloxane filler and preparation method thereof, and organic silicon foam material and preparation method thereof 株洲时代新材料科技股份有限公司 2023-07-28 CN disclosed
CN-114377825-B Device for improving dispersion degree of nano particles in polymer nano composite material 东南大学 2023-06-02 CN disclosed
WO-2022255290-A1 METHOD FOR MANUFACTURING PLANARIZING FILM, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-12-08 WO disclosed
CN-115362178-A Vinyl acetate-based copolymer dispersions having small particle size 国际人造丝公司 2022-11-18 CN disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
US-20080210948-A1 High-Heat-Resistive Semiconductor Device THE KANSAI ELECTRIC POWER CO., INC. (JP) 2008-09-04 US disclosed
EP-1888689-A4 POLYMERIC LUBRICANT HAVING MULTI LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF LG CHEMICAL LTD (KR) 2008-04-23 EP disclosed
EP-1888689-A1 POLYMERIC LUBRICANT HAVING MULTI LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF LG Chemical Co. Ltd (KR) 2008-02-20 EP disclosed
US-20070197755-A1 Silicon-containing curing composition and heat cured product thereof ADEKA CORPORATION (JP) 2007-08-23 US disclosed
EP-1801871-A1 SEMICONDUCTOR DEVICE THE KANSAI ELECTRIC POWER CO., INC. (JP) 2007-06-27 EP disclosed
EP-1746132-A1 SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME Adeka Corporation (JP) 2007-01-24 EP disclosed
WO-2006132471-A1 POLYMERIC LUBRICANT HAVING MULTI LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF LG CHEM, LTD. (KR) 2006-12-14 WO disclosed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP disclosed