⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6275470 | 0.83 | — | — | |
| SCHEMBL10416346 | 0.81 | CA1 (0.30) | — | |
| SCHEMBL4470670 | 0.79 | THRB (0.38) | — | |
| SCHEMBL676463 | 0.75 | — | — | |
| SCHEMBL891810 | 0.73 | — | — | |
| SCHEMBL17613420 | 0.73 | — | — | |
| SCHEMBL1477190 | 0.73 | — | — | |
| SCHEMBL5670484 | 0.73 | — | — | |
| SCHEMBL3733403 | 0.73 | — | — | |
| SCHEMBL8728903 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103917590-B | Rubber combination and studless tire | SUMITOMO RUBBER INDUSTRIES, LTD. (JP) | 2016-06-01 | — | — | CN | disclosed |
| EP-1746132-B1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | ADEKA CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| EP-1801871-B1 | SEMICONDUCTOR DEVICE | KANSAI ELECTRIC POWER CO (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-7939614-B2 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7772594-B2 | covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |