SCHEMBL676648

SCHEMBL676648

Cc1ccc2c(c1)CN(C)CO2

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.42
KDM4E B2RXH2 1/20 0.42
GAA P10253 2/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
SLC6A2 P23975 10/20 0.41
SLC6A4 P31645 10/20 0.41
SLC6A3 Q01959 10/20 0.41
RIPK1 Q13546 1/20 0.41
CYP2D6 P10635 1/20 0.38
ALDH1A1 P00352 1/20 0.36
HSD17B10 Q99714 1/20 0.36
CREBBP Q92793 1/20 0.35
VDR P11473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12633679 0.83 MAPT (0.44) MAPTKDM4EGAASMN1; SMN2CYP2D6
SCHEMBL20354517 0.82 RIPK1 (0.51) MAPTGAASLC6A2SLC6A4SLC6A3
SCHEMBL20345507 0.80 MAPT (0.41) MAPTKDM4EGAASMN1; SMN2
SCHEMBL20851057 0.80 HRH4 (0.42) MAPTKDM4ESMN1; SMN2SLC6A2SLC6A4
SCHEMBL17525923 0.80 MAPT (0.45) MAPTKDM4EGAASMN1; SMN2
SCHEMBL24383862 0.80 RIPK1 (0.43) MAPTGAASMN1; SMN2SLC6A2SLC6A4
SCHEMBL15444529 0.80 KDM4E (0.42) MAPTKDM4ESLC6A4CYP2D6ALDH1A1
SCHEMBL12206728 0.79 KDM4E (0.41) MAPTKDM4ESMN1; SMN2SLC6A2SLC6A4
SCHEMBL13169000 0.79 MAPT (0.41) MAPTKDM4EGAASMN1; SMN2SLC6A2
SCHEMBL14883704 0.79 MAPT (0.40) MAPTKDM4EGAASMN1; SMN2SLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220213267-A1 EXTREME HIGH TEMPERATURE STABLE ADHESIVES AND COATINGS DESIGNER MOLECULES, INC 2022-07-07 US disclosed
EP-3991968-A1 FILM, MULTILAYER BODY, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-05-04 EP disclosed
US-10815372-B2 Process for the preparation of a flame-retardant modified styrene-maleic anhydride resin and a composition of epoxy resins and their application to copper clad laminate and prepreg NAN YA PLASTICS CORPORATION (TW) 2020-10-27 US disclosed
WO-2020215025-A1 EXTREME HIGH TEMPERATURE STABLE ADHESIVES AND COATINGS DESIGNER MOLECULES, INC (US) 2020-10-22 WO disclosed
WO-2019178547-A1 BENZOXAZINE POLYMERS AND METHODS OF MAKING AND USING THE SAME THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2019-09-19 WO disclosed
US-10294595-B2 Polymer nanofiber sheet and method for producing the same CANON KABUSHIKI KAISHA (JP) 2019-05-21 US disclosed
US-9927625-B2 Birefringent lens material for stereoscopic image display device and method for producing birefringent lens for stereoscopic image display device DIC CORPORATION (JP) 2018-03-27 US disclosed
US-9927625-B2 Birefringent lens material for stereoscopic image display device and method for producing birefringent lens for stereoscopic image display device DIC CORPORATION (JP) 2018-03-27 US disclosed
US-9599829-B2 Birefringent lens material for stereoscopic image display device and method for producing birefringent lens for stereoscopic image display device DIC CORPORATION (JP) 2017-03-21 US disclosed
US-9599829-B2 Birefringent lens material for stereoscopic image display device and method for producing birefringent lens for stereoscopic image display device DIC CORPORATION (JP) 2017-03-21 US disclosed
US-20100144964-A1 BENZOXAZINE-CONTAINING FORMULATIONS POLYMERIZABLE/CURABLE AT LOW TEMPERATURE HENKEL AG & CO. KGAA (DE) 2010-06-10 US disclosed
US-20100144964-A1 BENZOXAZINE-CONTAINING FORMULATIONS POLYMERIZABLE/CURABLE AT LOW TEMPERATURE HENKEL AG & CO. KGAA (DE) 2010-06-10 US disclosed
US-20100099818-A1 BENZOXAZINE-FORMULATIONS WITH REDUCED OUTGASSING BEHAVIOUR HENKEL AG & CO. KGAA (DE) 2010-04-22 US disclosed
WO-2010018198-A1 POLYMERIZABLE BENZOXAZINE COMPOSITIONS HENKEL AG & CO. KGAA (DE) 2010-02-18 WO disclosed
US-20080302471-A1 Composition Comprising Benzoxazine and Epoxy Resin HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-12-11 US disclosed
WO-2008034814-A2 BENZOXAZINE-CONTAINING FORMULATIONS POLYMERIZABLE/CURABLE AT LOW TEMPERATURE HENKEL AG & CO. KGAA (DE) 2008-03-27 WO disclosed
US-20070117263-A1 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material SHI SONG-HUA 2007-05-24 US disclosed
US-20070117263-A1 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material SHI SONG-HUA 2007-05-24 US disclosed
US-7179684-B2 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material INTEL CORPORATION (US) 2007-02-20 US disclosed
US-7179684-B2 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material INTEL CORPORATION (US) 2007-02-20 US disclosed