Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APEX1 | P27695 | 2/20 | 0.62 |
| ▸ | GLA | P06280 | 1/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | ACE | P12821 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
| ▸ | CA9 | Q16790 | 1/20 | 0.39 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22542545 | 0.87 | APEX1 (0.52) | APEX1GLAKDM4EACEADORA2B | |
| SCHEMBL30004036 | 0.87 | APEX1 (0.52) | APEX1GLAKDM4EACEKMT2A | |
| SCHEMBL20967578 | 0.87 | APEX1 (0.52) | APEX1GLAKDM4EACEMEN1 | |
| SCHEMBL3767521 | 0.82 | HTT (0.53) | APEX1GLAKDM4EACEADORA2B | |
| SCHEMBL6522899 | 0.82 | APEX1 (0.63) | APEX1GLAKDM4EACEMEN1 | |
| SCHEMBL464613 | 0.82 | CYP3A4 (0.67) | APEX1GLAKDM4EACEKMT2A | |
| SCHEMBL435819 | 0.81 | — | — | |
| SCHEMBL30976969 | 0.80 | KDM4E (0.51) | APEX1KDM4EADORA2B | |
| SCHEMBL30976973 | 0.78 | APEX1 (0.63) | APEX1GLAKDM4EMEN1KMT2A | |
| SCHEMBL11808888 | 0.78 | APEX1 (0.48) | APEX1GLAKDM4EACEMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118103472-A | Adhesive, laminate, and packaging material | DIC株式会社 | 2024-05-28 | — | — | CN | disclosed |
| EP-4019566-B1 | EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRICAL OR ELECTRONIC COMPONENT | MITSUBISHI CHEM CORP (JP) | 2024-05-01 | — | — | EP | disclosed |
| US-11833620-B2 | Flux and solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2023-12-05 | — | — | US | disclosed |
| US-11815849-B2 | Electrophotographic photosensitive member, process cartridge and electrophotographic image forming apparatus | CANON KABUSHIKI KAISHA (JP) | 2023-11-14 | — | — | US | disclosed |
| US-11815849-B2 | Electrophotographic photosensitive member, process cartridge and electrophotographic image forming apparatus | CANON KABUSHIKI KAISHA (JP) | 2023-11-14 | — | — | US | disclosed |
| US-20230152719-A1 | ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2023-05-18 | — | — | US | disclosed |
| US-20230152719-A1 | ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2023-05-18 | — | — | US | disclosed |
| CN-109694682-B | Encapsulant for display | 日本化药株式会社 | 2023-03-17 | — | — | CN | disclosed |
| CN-115774356-A | Liquid crystal sealing agent for liquid crystal dropping method and liquid crystal display panel using same | 日本化药株式会社 | 2023-03-10 | — | — | CN | disclosed |
| WO-2023281922-A1 | HEAT-CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2023-01-12 | — | — | WO | disclosed |
| US-20100200882-A1 | THERMOSETTING LIGHT-REFLECTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING BOARD PRODUCED THEREWITH, METHOD FOR MANUFACTURE THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2010-08-12 | — | — | US | disclosed |
| EP-2199339-A1 | THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE MADE THEREFROM FOR PHOTOSEMICONDUCTOR ELEMENT MOUNTING, PROCESS FOR PRODUCING THE SAME, AND PHOTOSEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-06-23 | — | — | EP | disclosed |
| US-20100140638-A1 | THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION | HITACHI CHEMICAL CO., LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| US-6841305-B2 | High temperature, storage stability | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-01-11 | — | — | US | disclosed |
| EP-0906941-B1 | WEATHER-RESISTANT RESIN COMPOSITION FOR POWDER COATING | NISSAN CHEMICAL IND LTD (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-20020009652-A1 | High temperature, storage stability | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1160899-A2 | Non-aqueous electrolyte battery and non-aqueous electrolyte | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2001-12-05 | — | — | EP | disclosed |
| US-6084035-A | BIS(BETA-METHYLGLYCIDYL)TEREPHTHALATE CURING AGENT, CARBOXYL GROUP-CONTAINING RESIN, AND A RING-OPENING POLYMERIZATION INHIBITOR SELECTED FROM A COMPOUND HAVING AN AMIDINE LINKAGE, TRIARYLPHOSPHINES, AND ONIUM SALTS | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2000-07-04 | — | — | US | disclosed |
| EP-0906941-A1 | WEATHER-RESISTANT RESIN COMPOSITION FOR POWDER COATING | NISSAN CHEMICAL INDUSTRIES, LIMITED (JP) | 1999-04-07 | — | — | EP | disclosed |
| US-4623685-A | 1-PHENOXYCARBONYL-2,2,6,6-TETRAMETHYLPIPERIDYL COMPOUND | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1986-11-18 | — | — | US | disclosed |