SCHEMBL678658

SCHEMBL678658

C[C](C(=O)O)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Pyruvate SCHEMBL1331078 0.74
Oxalic Acid SCHEMBL7046230 0.74 LMNA (0.67)
Pyruvate SCHEMBL274319 0.74 TSHR (0.60)
SCHEMBL233754 0.74
Pyruvate SCHEMBL8710301 0.74 TSHR (0.60)
Pyruvate SCHEMBL23829857 0.74
Pyruvate SCHEMBL13165964 0.74
Oxalic Acid SCHEMBL1925909 0.74 FFAR3 (0.78)
Oxalic Acid SCHEMBL10553107 0.74 LMNA (0.67)
Pyruvate SCHEMBL8710299 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023102507-A1 MACROCYCLIC IMMUNOMODULATORS BRISTOL-MYERS SQUIBB COMPANY (US) 2023-06-08 WO claimed
CN-110561843-B Down fabric 合肥乖米熊科技有限公司 2022-01-25 CN claimed
CN-110172830-B Hydrophilic silicone oil finishing agent and preparation process thereof 绍兴柯桥欧利助剂有限公司 2021-12-10 CN claimed
CN-109628915-B Stable electroless copper compositions and methods for electroless copper plating on substrates 罗门哈斯电子材料有限责任公司 2021-01-26 CN claimed
US-10655227-B2 Stable electroless copper plating compositions and methods for electroless plating copper on substrates ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2020-05-19 US claimed
EP-3467148-B1 STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES ROHM & HAAS ELECT MAT (US) 2020-02-26 EP claimed
CN-110561843-A Down fabric 朱建余 2019-12-13 CN claimed
US-20190106793-A1 STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES ROHM AND HAAS ELECTRONIC MATERIALS LLC 2019-04-11 US claimed
EP-3467148-A1 STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES Rohm and Haas Electronic Materials LLC (US) 2019-04-10 EP claimed
US-9084724-B2 Water-in-oil type emulsion sunscreen cosmetics SHISEIDO CO., LTD. (JP) 2015-07-21 US claimed
EP-1278416-B1 LIQUID FORMULATIONS AVENTIS CROPSCIENCE GMBH (DE) 2004-04-07 EP claimed
JP-2003531838-A 2003-10-28 JP claimed
EP-1278416-A2 LIQUID FORMULATIONS Aventis CropScience GmbH (DE) 2003-01-29 EP claimed
US-20020016263-A1 Liquid formulations AVENTIS CROPSCIENCE GMBH (DE) 2002-02-07 US claimed
WO-2001082693-A2 LIQUID FORMULATIONS BAYER CROPSCIENCE GMBH (DE) 2001-11-08 WO claimed
US-5260050-A Bound to or associated with biocompatible and water soluble carbohydrate, oligosaccharide, polysaccharide or glycosaminoglycan carrier ACCESS PHARMACEUTICALS, INC. 1993-11-09 US claimed
US-5152929-A Corrosion inhibitors for water systems CIBA-GEIGY CORPORATION (US) 1992-10-06 US claimed
WO-1990003190-A1 METHODS AND COMPOSITIONS FOR MAGNETIC RESONANCE IMAGING RANNEY DAVID F (US) 1990-04-05 WO claimed
EP-0361960-A2 Methods and compositions for magnetic resonance imaging RANNEY, David F. (US) 1990-04-04 EP claimed
US-4165293-A Solid transparent cleanser AMWAY CORPORATION (US) 1979-08-21 US claimed