SCHEMBL679949

SCHEMBL679949

IC(I)c1ccc(-c2ccccc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.50
CHRNB2 P17787 1/20 0.50
CHRNA4 P43681 1/20 0.50
ACP3 P15309 2/20 0.46
PTGS2 P35354 1/20 0.46
CYP3A4 P08684 2/20 0.43
TAAR1 Q96RJ0 2/20 0.43
MAPK1 P28482 1/20 0.43
CYP1A2 P05177 1/20 0.43
HSD17B10 Q99714 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
MMP3 P08254 1/20 0.43
BCL2L1 Q07817 1/20 0.43
CYP17A1 P05093 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11438243 0.83 ALDH1A1 (0.50) ALDH1A1CHRNB2CHRNA4ACP3PTGS2
SCHEMBL329655 0.82
SCHEMBL16683785 0.79 PTGS2 (0.54) ALDH1A1CHRNB2CHRNA4ACP3PTGS2
SCHEMBL7987607 0.79 PTGS2 (0.54) ALDH1A1CHRNB2CHRNA4ACP3PTGS2
SCHEMBL8716106 0.77 DPP4 (0.43) TAAR1MAPK1
SCHEMBL2838545 0.77 ALDH1A1 (0.56) ALDH1A1CHRNB2CHRNA4ACP3PTGS2
SCHEMBL8715735 0.77 DPP4 (0.43) TAAR1MAPK1
SCHEMBL8717286 0.77 DPP4 (0.43) TAAR1MAPK1
SCHEMBL143471 0.74 ALDH1A1 (0.90) ALDH1A1CYP3A4TAAR1MAPK1CYP1A2
SCHEMBL1991754 0.74 ALDH1A1 (0.90) ALDH1A1CYP3A4TAAR1MAPK1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104136480-B Resin composition for encapsulation and electronic device using the same 住友电木株式会社 2017-05-31 CN disclosed
CN-104114639-B Resin composition for sealing and the electronic installation using it 住友电木株式会社 2016-11-09 CN disclosed
CN-103168061-B Resin composition for encapsulating and electronic part apparatus 住友电木株式会社 2016-08-31 CN disclosed
US-9136194-B2 Resin composition for encapsulation and electronic device using the same SUMITOMO BAKELITE CO., LTD. (JP) 2015-09-15 US disclosed
US-20150152258-A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2015-06-04 US disclosed
US-20150054180-A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2015-02-26 US disclosed
CN-104136480-A Resin composition for encapsulation and electronic device using the same SUMITOMO BAKELITE CO 2014-11-05 CN disclosed
CN-104114639-A Sealing resin composition and electronic device using same SUMITOMO BAKELITE CO 2014-10-22 CN disclosed
US-8502399-B2 Resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-06 US disclosed
US-8349989-B2 Method of sealing a semiconductor element with an epoxy resin composition AIR WATER INC. (JP) 2013-01-08 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed
US-20110281404-A1 METHOD OF SEALING A SEMICONDUCTOR ELEMENT WITH AN EPOXY RESIN COMPOSITION AIR WATER INC. (JP) 2011-11-17 US disclosed
US-7994271-B2 Phenolic resin, production method and use thereof AIR WATER INC. (JP) 2011-08-09 US disclosed
US-20090137725-A1 PHENOLIC RESIN, PRODUCTION METHOD AND USE THEREOF AIR WATER, INC. (JP) 2009-05-28 US disclosed