Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | CA9 | Q16790 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | EPHX1 | P07099 | 6/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | PAOX | Q6QHF9 | 3/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | RAB9A | P51151 | 1/20 | 0.33 |
| ▸ | DPP7 | Q9UHL4 | 1/20 | 0.33 |
| ▸ | CASP2 | P42575 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3912394 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL3913343 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL3912395 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL1142988 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL3908696 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL3909262 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL3920594 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL730236 | 0.98 | EPHX1 (0.39) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL896888 | 0.94 | CA12 (0.35) | CA12CA1CA2CA9MEN1 | |
| SCHEMBL35515 | 0.94 | CA12 (0.35) | CA12CA1CA2CA9MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2147041-A2 | METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL | Momentive Performance Materials Inc. (US) | 2010-01-27 | — | — | EP | claimed |
| WO-2008133916-A2 | METHOD OF APPLYING AN ANTI-CORROSION AND/OR ADHESION PROMOTING COATING TO A METAL AND RESULTING COATED METAL | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-11-06 | — | — | WO | claimed |
| US-20080268162-A1 | Method of applying an anti-corrosion and/or adhesion promoting coating to a metal and resulting coated metal | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-10-30 | — | — | US | claimed |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| EP-3255113-B1 | ADHESIVE AND/OR SEALANT COMPOSITION WITH HIGH INITIAL TACK | SOUDAL (BE) | 2025-11-05 | — | — | EP | disclosed |
| US-12386257-B2 | Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12386256-B2 | Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| WO-2025095080-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND CURED PRODUCT | 株式会社レゾナック | 2025-05-08 | — | — | WO | disclosed |
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| US-7151138-B2 | Resin composition of poly(aryl ketone), poly(arylene sulfide) and thermosetting imide resine | KUREHA CORPORATION (JP) | 2006-12-19 | — | — | US | disclosed |
| EP-1416015-B1 | Resin composition | KUREHA CHEMICAL IND CO LTD (JP) | 2006-01-18 | — | — | EP | disclosed |
| EP-1033388-B1 | THERMOPLASTIC RESIN COMPOSITION | KUREHA CHEMICAL IND CO LTD (JP) | 2006-01-18 | — | — | EP | disclosed |
| EP-1616909-A1 | RELEASE FILM FOR PRINTED WIRING BOARD PRODUCTION | Asahi Kasei Chemicals Corporation (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20040087733-A1 | Resin composition | KUREHA CORPORATION (JP) | 2004-05-06 | — | — | US | disclosed |
| EP-1416015-A1 | Resin composition | Kureha Chemical Industry Co., Ltd. (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-6545075-B2 | Thermoplastic resin composition | KUREHA KAGAKU KOGYO K.K. (JP) | 2003-04-08 | — | — | US | disclosed |
| US-20020107335-A1 | Resin component containing a poly(arylene sulfide) and a polyamide-imide; and a silane compound containing a functional group selected from the group consisting of amino, ureido, epoxy, isocyanate and mercapto groups. | KUREHA CORPORATION (JP) | 2002-08-08 | — | — | US | disclosed |
| EP-1033388-A1 | THERMOPLASTIC RESIN COMPOSITION | KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2000-09-06 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | CA12 2828/4885CA1 2076/4885CA2 2485/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.