SCHEMBL680894

SCHEMBL680894

CCOc1cc(C)c(OCC)o1

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.34
ALDH1A1 P00352 5/20 0.34
HPGD P15428 2/20 0.34
CYP1A2 P05177 2/20 0.33
CYP2C19 P33261 1/20 0.33
NQO1 P15559 1/20 0.32
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
ELANE P08246 2/20 0.31
POLB P06746 1/20 0.31
MAPT P10636 1/20 0.31
RXFP1 Q9HBX9 1/20 0.30
CA12 O43570 1/20 0.30
CA1 P00915 1/20 0.30
CA4 P22748 1/20 0.30
CA6 P23280 1/20 0.30
CA5A P35218 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27858863 0.88 KDM4E (0.37) KDM4EALDH1A1HPGDCYP1A2CYP2C19
SCHEMBL28158084 0.80 KDM4E (0.35) KDM4EALDH1A1HPGDCYP1A2CYP2C19
SCHEMBL21241301 0.80 KDM4E (0.35) KDM4EALDH1A1HPGDCYP1A2CYP2C19
SCHEMBL28158548 0.79 KDM4E (0.33) KDM4EALDH1A1HPGDTP53POLB
SCHEMBL27660249 0.74 TP53 (0.33) KDM4EALDH1A1HPGDCYP1A2CYP2C19
SCHEMBL1603208 0.72 ALDH1A1 (0.37) KDM4EALDH1A1HPGDCYP1A2CYP2C19
Water SCHEMBL28878288 0.71 ALDH1A1 (0.36) KDM4EALDH1A1HPGDCYP1A2CYP2C19
SCHEMBL28158103 0.71 KDM4E (0.30) KDM4EALDH1A1HPGD
SCHEMBL28208516 0.67 KDM4E (0.38) KDM4ENPC1RAB9ASMN1; SMN2MAPT
SCHEMBL826780 0.63 MAOB (0.45) KDM4EALDH1A1HPGDRAB9ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9943903-B2 Binder composition for making self-hardening foundry molds, and method of producing foundry mold using the same KAO CORPORATION (JP) 2018-04-17 US claimed
EP-2752258-B1 ADHESIVE AGENT COMPOSITION FOR MOLD USED IN SELF-HARDENING MOLDING AND METHOD FOR PRODUCING MOLD USING THE SAME KAO CORP (JP) 2017-10-04 EP claimed
US-20140296372-A1 BINDER COMPOSITION FOR MAKING SELF-HARDENING FOUNDRY MOLDS, AND METHOD OF PRODUCING FOUNDRY MOLD USING THE SAME KAO CORPORATION (JP) 2014-10-02 US claimed
EP-2752258-A1 ADHESIVE AGENT COMPOSITION FOR MOLD USED IN SELF-HARDENING MOLDING AND METHOD FOR PRODUCING MOLD USING THE SAME Kao Corporation (JP) 2014-07-09 EP claimed
JP-6297072-A None JP disclosed
WO-2020070819-A1 BINDER COMPOSITION FOR FORMING MOLD 花王株式会社 2020-04-09 WO disclosed
WO-2020039779-A1 MOLD SHAPING BINDER COMPOSITION 花王株式会社 2020-02-27 WO disclosed
CN-105689636-B Making molds suit 花王株式会社 2019-11-12 CN disclosed
EP-2548674-B1 BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING KAO CORP (JP) 2019-05-01 EP disclosed
EP-2517807-B1 BINDER COMPOSITION FOR THE FORMATION OF SELF-CURING MOLDS KAO CORP (JP) 2018-06-20 EP disclosed
US-9943903-B2 Binder composition for making self-hardening foundry molds, and method of producing foundry mold using the same KAO CORPORATION (JP) 2018-04-17 US disclosed
EP-2752258-B1 ADHESIVE AGENT COMPOSITION FOR MOLD USED IN SELF-HARDENING MOLDING AND METHOD FOR PRODUCING MOLD USING THE SAME KAO CORP (JP) 2017-10-04 EP disclosed
CN-1062202-C Binder composition for mold production and process for producing mold KAO CARP (JP) 2001-02-21 CN disclosed
US-5932628-A BLEND OF SAND AND POLYFURFURAL ALCOHOL KAO CORPORATION (JP) 1999-08-03 US disclosed
CN-1155856-A Binder composition for mold production and process for producing mold KAO CORP (JP) 1997-07-30 CN disclosed
EP-0778095-A1 BINDER COMPOSITION FOR MOLD PRODUCTION AND PROCESS FOR PRODUCING MOLD Kao Corporation (JP) 1997-06-11 EP disclosed
US-5616631-A CONTAINING FURAN DERIVATIVES AS CURING ACCELERATORS KAO CORPORATION (JP) 1997-04-01 US disclosed
EP-0698432-A1 Binder composition for mold making, binder/curing agent composition for mold making and sand composition for mold making Kao Corporation (JP) 1996-02-28 EP disclosed
US-5491180-A ACID CURABLE RESIN AND FURANDIMETHANOL DERIVATIVE AS CURING ACCELERATOR KAO CORPORATION (JP) 1996-02-13 US disclosed
JP-H06297072-A BINDER COMPOSITION FOR PRODUCTION OF CASTING MOLD, SAND COMPOSITION FOR PRODUCTION OF CASTING MOLD AND PRODUCTION OF CASTING MOLD KAO CORP 1994-10-25 JP disclosed