Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 2/20 | 0.36 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.36 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.36 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.36 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.36 |
| ▸ | CA1 | P00915 | 3/20 | 0.33 |
| ▸ | CES2 | O00748 | 2/20 | 0.33 |
| ▸ | CES1 | P23141 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.32 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | CYP4F2 | P78329 | 1/20 | 0.31 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.31 |
| ▸ | BBOX1 | O75936 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11649902 | 0.97 | FFAR3 (0.35) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL4777919 | 0.94 | FFAR3 (0.41) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Silver SCHEMBL17797184 | 0.94 | FFAR3 (0.36) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL4957927 | 0.94 | FFAR3 (0.36) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL15022121 | 0.94 | FFAR3 (0.36) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Lithium Ion SCHEMBL18321792 | 0.94 | FFAR3 (0.36) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Potassium Ion SCHEMBL2349658 | 0.94 | CA4 (0.37) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Tetramethylammonium Ion SCHEMBL2348519 | 0.88 | BBOX1 (0.38) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Tetrylammonium SCHEMBL2351305 | 0.84 | TSHR (0.40) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL4920283 | 0.84 | BBOX1 (0.40) | FFAR3HDAC3HDAC1HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-4084444-A | — | — | None | — | — | JP | disclosed |
| WO-2021145064-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-COMPONENT CURABLE RESIN COMPOSITION | 株式会社カネカ | 2021-07-22 | — | — | WO | disclosed |
| WO-2021125061-A1 | CURABLE COMPOSITION | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021125060-A1 | CURABLE COMPOSITION | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021125062-A1 | CURABLE COMPOSITION | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021125058-A1 | CURABLE COMPOSITION | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021125059-A1 | CURABLE COMPOSITION | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 2021-06-24 | — | — | WO | disclosed |
| WO-2021049278-A1 | ADDITION-CURABLE LIQUID SILICONE RUBBER COMPOSITION FOR AIRBAGS, AND AIRBAG | 信越化学工業株式会社 | 2021-03-18 | — | — | WO | disclosed |
| WO-2020235524-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-COMPONENT CURABLE RESIN COMPOSITION | 株式会社カネカ (JP) | 2020-11-26 | — | — | WO | disclosed |
| CN-111587182-A | Coated with silica | 株式会社太洋工作所 | 2020-08-25 | — | — | CN | disclosed |
| EP-1146084-B1 | Curable composition | KANEKA CORP (JP) | 2004-09-22 | — | — | EP | disclosed |
| EP-1077763-B1 | ENCAPSULATED ACTIVE MATERIALS UND PROCESS OF PREPARATION | DOW CHEMICAL CO (US) | 2004-02-11 | — | — | EP | disclosed |
| US-6624260-B2 | Epoxy resin comprising reactive silicon group- containing polyoxyalkylene polymer with a copolymer having alkyl acrylate monomers, and curing agent; peel strength | KANEKA CORPORATION (JP) | 2003-09-23 | — | — | US | disclosed |
| US-20020016411-A1 | Curable composition | KANEKA CORPORATION (JP) | 2002-02-07 | — | — | US | disclosed |
| EP-1146084-A2 | Curable composition | KANEKA CORPORATION (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6224793-B1 | POLYMER ENCAPSULATION OF PARTICLES, EXTRACTION WITH SOLVENT | THE DOW CHEMICAL COMPANY | 2001-05-01 | — | — | US | disclosed |
| EP-1077763-A1 | ENCAPSULATED ACTIVE MATERIALS | THE DOW CHEMICAL COMPANY (US) | 2001-02-28 | — | — | EP | disclosed |
| WO-1999055454-A1 | ENCAPSULATED ACTIVE MATERIALS | THE DOW CHEMICAL COMPANY (US) | 1999-11-04 | — | — | WO | disclosed |
| US-5510428-A | Compositions, epoxized compositions, a heat curable resin composition, an epoxy resin composition, radically polymerized compositions, a curable resin composition and a polymer having epoxy groups | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| JP-H0484444-A | CONDUCTIVE PASTE | TOSHIBA CHEM CORP | 1992-03-17 | — | — | JP | disclosed |