SCHEMBL682111

SCHEMBL682111

C=CCOCC1(C)CCCCC1

nearest known ligand 0.41

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 1/20 0.34
HPGD P15428 1/20 0.34
ALDH1A1 P00352 2/20 0.32
MEN1 O00255 1/20 0.31
POLB P06746 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10435676 0.82 ATP1A1 (0.32) ALDH1A1
SCHEMBL15475768 0.80 ALDH1A1 (0.33) ALDH1A1
SCHEMBL6938889 0.79 HPGD (0.37) PARP1HPGDALDH1A1MEN1KMT2A
SCHEMBL7564099 0.79 HPGD (0.37) PARP1HPGDALDH1A1MEN1KMT2A
SCHEMBL17491155 0.78 ALDH1A1 (0.34) ALDH1A1
SCHEMBL14914110 0.78 ALDH1A1 (0.34) ALDH1A1
SCHEMBL9750724 0.77 HPGD (0.34) PARP1HPGDALDH1A1MEN1KMT2A
SCHEMBL761610 0.75 EPHX1 (0.38) ALDH1A1MEN1POLBKMT2A
SCHEMBL14185122 0.74 PARP1 (0.33) PARP1HPGD
SCHEMBL10305806 0.73 HPGD (0.34) PARP1HPGDALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8389630-B2 Curable composition KANEKA CORPORATION (JP) 2013-03-05 US disclosed
US-8067498-B2 Transparent curable polymer; one package process; high strength, elongation, weatherproofing, adhesive; blend containing vinyl living polymer, containing crosslinkable silicon groups, graft polymer containing rubber and acrylic ester with vinyl monomer and silica filler KANEKA CORPORATION (JP) 2011-11-29 US disclosed
US-7807746-B2 Curable composition KANEKA CORPORATION (JP) 2010-10-05 US disclosed
US-20100227949-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-09-09 US disclosed
US-20100222446-A1 CURABLE COMPOSITION FOR BOTH PHOTORADICAL CURING AND THERMAL RADICAL CURING KANEKA CORPORATION (JP) 2010-09-02 US disclosed
US-20100216954-A1 Modified Thermoplastic Resin KANEKA CORPORATION (JP) 2010-08-26 US disclosed
US-7781494-B2 Active energy curing type composition for in-place shaping gasket and in-place shaped gasket KANEKA CORPORATION (JP) 2010-08-24 US disclosed
US-7781495-B2 Composition curable by radical photo curing and cationic photo curing in combination KANEKA CORPORATION (JP) 2010-08-24 US disclosed
US-7781534-B2 Process for producing vinyl polymer, vinyl polymer, and curable composition KANEKA CORPORATION (JP) 2010-08-24 US disclosed
US-7705092-B2 Process for producing vinyl polymer KANEKA CORPORATION (JP) 2010-04-27 US disclosed
US-20070203296-A1 Active Energy Curing Type Composition For In-Place Shaping Gasket And In-Place Shaped Gasket KANEKA CORPORATION (JP) 2007-08-30 US disclosed
US-20070179249-A1 Curing composition KANEKA CORPORATION (JP) 2007-08-02 US disclosed
US-20070167583-A1 Curable composition KANEKA CORPORATION (JP) 2007-07-19 US disclosed
US-20070161732-A1 Novel polymer and liquid gasket for In-Place forming KANEKA CORPORATION (JP) 2007-07-12 US disclosed
US-20070135590-A1 Curable composition and cured product thereof KANEKA CORPORATION (JP) 2007-06-14 US disclosed
US-7223817-B2 Polymer, processes for producing polymer and composition KANEKA CORPORATION (JP) 2007-05-29 US disclosed
US-7202310-B2 Polymers, processes for producing the same, and curable compositions produced therefrom KANEKA CORPORATION (JP) 2007-04-10 US disclosed
US-7186780-B2 Polymer and liquid gasket for in-place forming KANEKA CORPORATION (JP) 2007-03-06 US disclosed
US-20070021563-A1 Curable composition KANEKA CORPORATION (JP) 2007-01-25 US disclosed
US-20070004880-A1 Polymer, process for producing the polymer, and curable composition containing the polymer KANEKA CORPORATION (JP) 2007-01-04 US disclosed