SCHEMBL6832067

SCHEMBL6832067

CC(S)CCOC(=O)c1ccccc1C(=O)O

nearest known ligand 0.63

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.53
TSHR P16473 7/20 0.51
TDP1 Q9NUW8 3/20 0.50
L3MBTL1 Q9Y468 2/20 0.50
CYP3A4 P08684 3/20 0.49
MAPK1 P28482 2/20 0.49
TP53 P04637 1/20 0.49
LMNA P02545 1/20 0.47
ALOX15 P16050 1/20 0.44
KDM4E B2RXH2 1/20 0.43
HSD17B10 Q99714 1/20 0.43
CA2 P00918 1/20 0.42
MAPT P10636 1/20 0.42
HDAC8 Q9BY41 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1171242 0.94 ALDH1A1 (0.59) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL29895948 0.94 ALDH1A1 (0.59) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL7059436 0.87 ALDH1A1 (0.59) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
Ethane SCHEMBL28902205 0.86 ALDH1A1 (0.57) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL4078490 0.86 ALDH1A1 (0.54) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL30850226 0.86 ALDH1A1 (0.54) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL6831503 0.85 ALDH1A1 (0.66) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL7760886 0.84 ALDH1A1 (0.53) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL27908787 0.83 ALDH1A1 (0.56) ALDH1A1TSHRTDP1L3MBTL1CYP3A4
SCHEMBL28924730 0.82 ALDH1A1 (0.58) ALDH1A1TSHRTDP1L3MBTL1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230058675-A1 RADICALLY POLYMERIZABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2023-02-23 US disclosed
CN-111752091-B Application of HABI mixed photoinitiator in UVLED photocuring 常州正洁智造科技有限公司 2022-09-06 CN disclosed
CN-113166416-A Multicomponent system for producing foamed products 阿科玛法国公司 2021-07-23 CN disclosed
WO-2021132140-A1 RADICALLY POLYMERIZABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 昭和電工株式会社 2021-07-01 WO disclosed
WO-2021132139-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM 昭和電工株式会社 2021-07-01 WO disclosed
WO-2021039732-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER 富士フイルム株式会社 2021-03-04 WO disclosed
CN-111752100-A Photosensitive resin composition containing bisimidazole photoinitiator, application thereof, color filter and image display device 常州强力电子新材料股份有限公司 2020-10-09 CN disclosed
CN-111752091-A Application of HABI mixed photoinitiator in UVLED photocuring 常州格林感光新材料有限公司 2020-10-09 CN disclosed
EP-1478668-A2 THIOL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPOSITION AND PHOTOSENSITIVE COMPOSITION Showa Denko K.K. (JP) 2004-11-24 EP disclosed
WO-2003072614-A2 THIOL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPOSITION AND PHOTOSENSITIVE COMPOSITION SHOWA DENKO K.K. (JP) 2003-09-04 WO disclosed