SCHEMBL6842055

SCHEMBL6842055

O=C(c1cc(C(=O)c2ccc(O)c(O)c2O)c(C(=O)c2ccc(O)c(O)c2O)cc1C(=O)c1ccc(O)c(O)c1O)c1ccc(O)c(O)c1O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.67
SELL P14151 1/20 0.60
SELP P16109 1/20 0.60
HPGD P15428 3/20 0.47
ALOX15 P16050 3/20 0.47
KDM4E B2RXH2 2/20 0.47
ALDH1A1 P00352 2/20 0.47
MAPT P10636 2/20 0.47
RECQL P46063 2/20 0.47
HSD17B10 Q99714 2/20 0.47
MEN1 O00255 1/20 0.46
ALOX12 P18054 1/20 0.46
KMT2A Q03164 1/20 0.46
TERT O14746 1/20 0.46
CYP1A2 P05177 1/20 0.45
CYP2C9 P11712 1/20 0.45
CASP1 P29466 1/20 0.45
CYP2C19 P33261 1/20 0.45
PIK3CA P42336 5/20 0.44
FNTA P49354 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29942817 1.00 HDAC1 (0.67) HDAC1SELLSELPHPGDALOX15
SCHEMBL1063407 0.93 SELL (0.68) HDAC1SELLSELPHPGDALOX15
SCHEMBL9640017 0.86 HDAC1 (0.68) HDAC1SELLSELPHPGDALOX15
SCHEMBL6848659 0.86 HDAC1 (0.67) HDAC1SELLSELPHPGDALOX15
SCHEMBL31676578 0.86 HDAC1 (0.67) HDAC1SELLSELPHPGDALOX15
SCHEMBL8649470 0.85 HDAC1 (0.60) HDAC1SELLSELPHPGDALOX15
SCHEMBL10764992 0.84 HDAC1 (0.55) HDAC1SELLSELPHPGDALOX15
SCHEMBL273458 0.84 HDAC1 (0.59) HDAC1SELLSELPHPGDALOX15
SCHEMBL6847401 0.84 HDAC1 (0.84) HDAC1SELLSELPHPGDALOX15
SCHEMBL3656656 0.84 HDAC1 (0.59) HDAC1SELLSELPHPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
WO-2024185652-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-09-12 WO disclosed
WO-2024150700-A1 RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-07-18 WO disclosed
WO-2024143211-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024143210-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
US-5523396-A ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST FUJI PHOTO FILM CO., LTD. (JP) 1996-06-04 US disclosed
EP-0710886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-05-08 EP disclosed
EP-0706089-A2 Process for synthesizing quinonediazide ester and positive working photoresist containing the same FUJI PHOTO FILM CO., LTD. (JP) 1996-04-10 EP disclosed
US-5494773-A MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-02-27 US disclosed
EP-0684521-A1 Positive working photosensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1995-11-29 EP disclosed
EP-0677789-A1 Positive photoresist composition Fuji Photo Film Co., Ltd. (JP) 1995-10-18 EP disclosed
EP-0672952-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-09-20 EP disclosed
EP-0658807-A1 Positive-working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-06-21 EP disclosed
EP-0644460-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-03-22 EP disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed