⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27339783 | 0.87 | — | — | |
| SCHEMBL809345 | 0.87 | VCP (0.33) | — | |
| SCHEMBL6266939 | 0.85 | VCP (0.32) | — | |
| SCHEMBL419449 | 0.83 | VCP (0.38) | — | |
| SCHEMBL6852403 | 0.82 | — | — | |
| SCHEMBL6853641 | 0.81 | VCP (0.33) | — | |
| SCHEMBL1808857 | 0.80 | VCP (0.36) | — | |
| SCHEMBL22042201 | 0.79 | MEN1 (0.32) | — | |
| SCHEMBL24834495 | 0.78 | — | — | |
| SCHEMBL1809301 | 0.76 | VCP (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-20210309866-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| EP-3812805-A1 | LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-04-28 | — | — | EP | disclosed |
| CN-112334795-A | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2021-02-05 | — | — | CN | disclosed |
| CN-107429059-B | Energy-sensitive resin composition | 东京应化工业株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-106575080-B | Energy-sensitive resin composition | 东京应化工业株式会社 | 2020-08-11 | — | — | CN | disclosed |
| US-10696845-B2 | Energy-sensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| US-10570269-B2 | Composition containing microparticles | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-02-25 | — | — | US | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| CN-105579907-B | Radiation-sensitive composition and pattern production method | 东京应化工业株式会社 | 2019-12-17 | — | — | CN | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| CN-107429059-A | ENERGY-SENSITIVE RESIN COMPOSITION | 东京应化工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| EP-2947112-B1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO LTD (JP) | 2017-09-13 | — | — | EP | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| CN-106575080-A | Energy-sensitive resin composition | 东京应化工业株式会社 | 2017-04-19 | — | — | CN | disclosed |
| CN-105579907-A | Radiation-sensitive composition and pattern production method | TOKYO OHKA KOGYO CO LTD | 2016-05-11 | — | — | CN | disclosed |
| US-20150337084-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-26 | — | — | US | disclosed |
| EP-2947112-A1 | METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-11-25 | — | — | EP | disclosed |
| US-6780561-B2 | FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD | KANSAI PAINT CO., LTD. (JP) | 2004-08-24 | — | — | US | disclosed |
| US-20030143480-A1 | For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board | KANSAI PAINT CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |