⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10456470 | 0.84 | GABRA1 (0.36) | — | |
| SCHEMBL31017690 | 0.84 | GABRA1 (0.36) | — | |
| SCHEMBL2885206 | 0.82 | P2RX7 (0.31) | — | |
| SCHEMBL10455643 | 0.77 | — | — | |
| SCHEMBL5080443 | 0.76 | — | — | |
| SCHEMBL2884520 | 0.76 | — | — | |
| SCHEMBL9859294 | 0.76 | — | — | |
| SCHEMBL10748044 | 0.75 | HTT (0.31) | — | |
| SCHEMBL8373912 | 0.74 | TDP1 (0.39) | — | |
| SCHEMBL358557 | 0.72 | CYP2A6 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114262479-B | Resin composition, and communication cable and wire harness using the same | 矢崎总业株式会社 | 2023-09-15 | — | — | CN | disclosed |
| CN-112011014-B | Resin composition and use thereof | 台燿科技股份有限公司 | 2022-11-22 | — | — | CN | disclosed |
| CN-114262479-A | Resin composition, and communication cable and wire harness using the same | 矢崎总业株式会社 | 2022-04-01 | — | — | CN | disclosed |
| CN-107177190-B | Resin composition and use thereof | 台燿科技股份有限公司 | 2019-08-20 | — | — | CN | disclosed |
| CN-107177189-B | Resin composition and use thereof | 台燿科技股份有限公司 | 2019-08-20 | — | — | CN | disclosed |
| CN-109971369-A | Adhesive agent composition and its application | 台燿科技股份有限公司 | 2019-07-05 | — | — | CN | disclosed |
| CN-109517333-A | Solvent-free resin composition and use thereof | 台燿科技股份有限公司 | 2019-03-26 | — | — | CN | disclosed |
| CN-107663374-A | Resin composition, semi-cured sheet and laminate | 台燿科技股份有限公司 | 2018-02-06 | — | — | CN | disclosed |
| CN-107177189-A | Resin composition and use thereof | 台燿科技股份有限公司 | 2017-09-19 | — | — | CN | disclosed |
| CN-107177190-A | Resin composition and use thereof | 台燿科技股份有限公司 | 2017-09-19 | — | — | CN | disclosed |
| US-6780348-B1 | COMPOSITION COMPRISING MIXTURE OF POLYBROMODIPHENYLALKANE IN WHICH PHENYL GROUPS ARE SUBSTITUTED BY AT LEAST 6 BROMINE ATOMS AND ALKANE PORTION OF MOLECULE CONTAINS 1 TO 3 CARBON ATOMS, AND TETRABROMOBISPHENOL-A-BIS(BROMOALKYL ETHER) | ALBEMARLE CORPORATION | 2004-08-24 | — | — | US | disclosed |