SCHEMBL6852425

SCHEMBL6852425

O=Cc1cccc(Cc2cccc(C=O)c2)c1

nearest known ligand 0.52

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.52
MAOA P21397 7/20 0.52
MAOB P27338 7/20 0.52
UNG P13051 1/20 0.47
CYP2A6 P11509 1/20 0.46
ELANE P08246 1/20 0.45
CALM1 P0DP23 1/20 0.43
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
SRC P12931 1/20 0.41
TRIM24 O15164 1/20 0.40
TRIM33 Q9UPN9 1/20 0.40
FFAR1 O14842 1/20 0.39
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CA9 Q16790 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL417837 0.96 MAOA (0.58) ALDH1A1MAOAMAOBUNGCYP2A6
SCHEMBL6856786 0.94 MAOA (0.47) ALDH1A1MAOAMAOBUNGCYP2A6
SCHEMBL30644980 0.88 HSD17B10 (0.48) ALDH1A1MAOAMAOBUNGELANE
SCHEMBL18001507 0.88 HSD17B10 (0.48) ALDH1A1MAOAMAOBUNGELANE
SCHEMBL30644993 0.88 PNMT (0.47) ALDH1A1MAOAMAOB
SCHEMBL11400148 0.88 MAOA (0.59) ALDH1A1MAOAMAOBUNGELANE
SCHEMBL20546807 0.88 PNMT (0.47) ALDH1A1MAOAMAOB
SCHEMBL20546750 0.88 MAOA (0.62) ALDH1A1MAOAMAOBNPC1TDP1
SCHEMBL20546828 0.88 MAOA (0.59) ALDH1A1MAOAMAOBUNGCYP2A6
SCHEMBL30644975 0.88 MAOA (0.62) ALDH1A1MAOAMAOBNPC1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117024912-A High-pressure-bearing epoxy resin plugging material and oil-based drilling fluid 西南石油大学 2023-11-10 CN claimed
CN-117024912-A High-pressure-bearing epoxy resin plugging material and oil-based drilling fluid 西南石油大学 2023-11-10 CN disclosed
US-6780561-B2 FOR FORMING PROTECTIVE FILM OR AN INSULATING FILM FOR A SEMICONDUCTOR ELEMENT OR A CIRCUIT BOARD SUCH AS A PRINTED BOARD KANSAI PAINT CO., LTD. (JP) 2004-08-24 US disclosed
US-20030143480-A1 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board KANSAI PAINT CO., LTD. (JP) 2003-07-31 US disclosed