SCHEMBL6856313

SCHEMBL6856313

CCCCONC(=O)/C(C)=C/CO

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
CNR2 P34972 2/20 0.38
TRPV1 Q8NER1 2/20 0.38
CNR1 P21554 1/20 0.36
ATM Q13315 1/20 0.36
MAPT P10636 1/20 0.35
RAB9A P51151 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
TSHR P16473 2/20 0.34
HPGD P15428 1/20 0.34
EPHX2 P34913 1/20 0.33
HCAR2 Q8TDS4 1/20 0.33
ALOX15 P16050 1/20 0.32
ACHE P22303 2/20 0.32
CES2 O00748 1/20 0.31
ADRB2 P07550 1/20 0.30
ADRB1 P08588 1/20 0.30
ADRB3 P13945 1/20 0.30
FAAH O00519 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6856318 1.00 ALDH1A1 (0.38) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL21694736 0.88 ALDH1A1 (0.39) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL13506270 0.84 ALDH1A1 (0.42) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL237669 0.84 ALDH1A1 (0.42) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL27907041 0.79 CES2 (0.40) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL6021940 0.77 ALDH1A1 (0.36) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL6021937 0.77 ALDH1A1 (0.36) ALDH1A1CNR2TRPV1CNR1ATM
SCHEMBL11344358 0.75 TSHR (0.33) TSHR
SCHEMBL11769173 0.75 TSHR (0.33) TSHR
SCHEMBL194349 0.74 TSHR (0.44) ALDH1A1CNR2TRPV1CNR1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4305859-A THERMOSETTING ENAMELS CANADIAN INDUSTRIES LIMITED (CA) 1981-12-15 US claimed
CN-119604817-A Positive photosensitive resin composition 日产化学株式会社 2025-03-11 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
CN-110537146-B Photosensitive resin composition 日产化学株式会社 2024-03-15 CN disclosed
EP-0787830-B1 Chromium-free composition for the treatment of metallic surfaces TOYO BOSEKI (JP) 2004-04-14 EP disclosed
EP-1378547-A1 Surface-treated metal sheet Toyo Boseki Kabushiki Kaisha (JP) 2004-01-07 EP disclosed
US-6040054-A HYDROXY ORGANIC RESIN, PHOSPHORIC ACID AND METAL ION TO FORM OXIDE TOYO BOSEKI KABUSHIKI KAISHA (JP) 2000-03-21 US disclosed
EP-0787830-A2 Chromium-free, metal surface-treating composition and surface-treated metal sheet Toyo Boseki Kabushiki Kaisha (JP) 1997-08-06 EP disclosed
US-4994133-A Impregnating substrate with unsaturated polyester; curing KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
US-4571279-A CELLULOSIC SUBSTRATE CROSSLINKED WITH UNSATURATED POLYESTER BY N-METHYLOL COMPOUND KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-02-18 US disclosed
US-4451317-A Continuous process for producing reinforced resin laminates KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-05-29 US disclosed
US-4372800-A Continuous process for producing reinforced resin laminates KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1983-02-08 US disclosed
EP-0031852-A1 PROCESS AND APPARATUS FOR CONTINUOUS PRODUCTION OF LAMINATES KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1981-07-15 EP disclosed