⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL797700 | 0.89 | — | — | |
| SCHEMBL6850741 | 0.87 | PTGS2 (0.32) | — | |
| SCHEMBL6856823 | 0.85 | PTGS2 (0.34) | — | |
| SCHEMBL6851049 | 0.83 | — | — | |
| SCHEMBL5478276 | 0.82 | — | — | |
| SCHEMBL7175220 | 0.82 | — | — | |
| SCHEMBL28449274 | 0.78 | — | — | |
| SCHEMBL21248066 | 0.77 | — | — | |
| SCHEMBL21247870 | 0.77 | — | — | |
| SCHEMBL16667144 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| CN-114402256-A | Organic film, method for producing same, composition, laminate, and semiconductor device | 富士胶片株式会社 | 2022-04-26 | — | — | CN | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| CN-113383273-A | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2021-09-10 | — | — | CN | disclosed |
| CN-113168093-A | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2021-07-23 | — | — | CN | disclosed |
| EP-3492982-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| EP-3492982-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |
| US-6787617-B1 | FORMING NARROW MOLECULAR WEIGHT HOMOPOLYMERS AS INTERMEDIATES TO BLOCK OR TERMINAL FUNCTIONALIZED POLYMERS; HAFNIUM OR ZIRCONIUM CYCLOPENTADIENYL FUNCTIONALIZED CATALYSTS WITH TRIPHENYLBORON AND TRIALKYLALUMINUM COMPOUNDS | JAPAN AS REPRESENTED BY DIRECTOR GENERAL OF THE AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-09-07 | — | — | US | disclosed |
| EP-1209171-A1 | PROCESS FOR PRODUCING OLEFIN LIVING POLYMER | JAPAN as Represented by DIRECTOR GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2002-05-29 | — | — | EP | disclosed |