SCHEMBL6862979

SCHEMBL6862979

CCCOS(=O)(=O)[O-].CCCOS(=O)(=O)[O-].[Cu+2]

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RECQL P46063 2/20 0.60
TSHR P16473 2/20 0.60
GLA P06280 1/20 0.60
HPGD P15428 1/20 0.60
MAPK1 P28482 1/20 0.60
EPHX2 P34913 1/20 0.60
BLM P54132 1/20 0.60
CA1 P00915 13/20 0.52
CA2 P00918 13/20 0.52
CA9 Q16790 9/20 0.36
CA12 O43570 4/20 0.34
CA7 P43166 4/20 0.34
CA14 Q9ULX7 3/20 0.34
CA3 P07451 2/20 0.34
CA4 P22748 2/20 0.34
CA6 P23280 2/20 0.34
CA5A P35218 2/20 0.34
CA5B Q9Y2D0 2/20 0.34
KDM4E B2RXH2 1/20 0.32
USP2 O75604 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17456440 0.94 RECQL (0.60) RECQLTSHRGLAHPGDMAPK1
Potassium Ion SCHEMBL10600320 0.94
SCHEMBL6525696 0.94
Lithium Ion SCHEMBL17456536 0.94
SCHEMBL2634707 0.94
Water SCHEMBL1134659 0.92 RECQL (0.64) RECQLTSHRGLAHPGDMAPK1
Tetramethylammonium Ion SCHEMBL4623396 0.90 RECQL (0.56) RECQLTSHRGLAHPGDMAPK1
Methyl Alcohol SCHEMBL27946779 0.90 RECQL (0.56) RECQLTSHRGLAHPGDMAPK1
Lithium Ion SCHEMBL28616477 0.85 RECQL (0.52) RECQLTSHRGLAHPGDMAPK1
SCHEMBL5451303 0.80 RECQL (0.91) RECQLTSHRGLAHPGDMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111218686-A Etching liquid composition 易安爱富科技有限公司 2020-06-02 CN claimed
CN-111235555-B Two-layer flexible copper-clad laminate substrate and method for producing same 株式会社杰希优 2022-04-29 CN disclosed
CN-111235555-A Two-layer flexible copper-clad laminate substrate and method for producing same 株式会社杰希优 2020-06-05 CN disclosed
CN-111218686-A Etching liquid composition 易安爱富科技有限公司 2020-06-02 CN disclosed
US-6800188-B2 REACTION PRODUCT OF AMINES WITH GLYCIDYL ETHER OR QUATERNARY AMMONIUM COMPOUND EBARA-UDYLITE CO., LTD. (JP) 2004-10-05 US disclosed
US-20030106802-A1 Copper plating bath and plating method for substrate using the copper plating bath EBARA-UDYLITE CO., LTD. (JP) 2003-06-12 US disclosed