SCHEMBL686318

SCHEMBL686318

CCC1(COC(=O)c2ccc(C(=O)OCC3(CC)COC3)cc2)COC1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.50
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
ESR1 P03372 3/20 0.43
CA12 O43570 1/20 0.43
CA1 P00915 1/20 0.43
CA2 P00918 1/20 0.43
CA7 P43166 1/20 0.43
CA9 Q16790 1/20 0.43
ESR2 Q92731 1/20 0.43
CA14 Q9ULX7 1/20 0.43
LMNA P02545 4/20 0.42
CYP1A2 P05177 3/20 0.42
CYP3A4 P08684 2/20 0.42
MAOA P21397 1/20 0.42
POLB P06746 1/20 0.42
HSD17B10 Q99714 1/20 0.42
ALDH1A1 P00352 2/20 0.41
CHRM1 P11229 1/20 0.41
SLC6A2 P23975 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14839354 0.95 TSHR (0.47) TSHRMEN1KMT2AESR1CA12
SCHEMBL15799989 0.94 ESR1 (0.54) TSHRMEN1KMT2AESR1CA12
SCHEMBL16119470 0.94 MAPT (0.47) TSHRMEN1KMT2AESR1CA12
SCHEMBL12959101 0.94 RAB9A (0.47) TSHRMEN1KMT2AESR1CA12
SCHEMBL14497538 0.93 TSHR (0.45) TSHRMEN1KMT2AESR1CA12
SCHEMBL14839401 0.93 TSHR (0.47) TSHRMEN1KMT2AESR1CA12
SCHEMBL14491810 0.93 TSHR (0.48) TSHRMEN1KMT2AESR1LMNA
SCHEMBL17465564 0.93 POLB (0.46) TSHRMEN1KMT2AESR1CA12
SCHEMBL9215046 0.93 TSHR (0.45) TSHRMEN1KMT2AESR1CA12
SCHEMBL16077672 0.93 TSHR (0.55) TSHRMEN1KMT2ACA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 234 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12016187-B2 Encapsulating composition LG CHEM, LTD. (KR) 2024-06-18 US claimed
US-20210234111-A1 Encapsulating Composition LG CHEM, LTD. (KR) 2021-07-29 US claimed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-3859447-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-11-19 EP disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
US-12473403-B2 Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor FUJIFILM CORPORATION (JP) 2025-11-18 US disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-2312593-A1 INSULATING SHEET AND MULTILAYER STRUCTURE Sekisui Chemical Co., Ltd. (JP) 2011-04-20 EP disclosed
US-20100297453-A1 INSULATING SHEET AND MULTILAYER STRUCTURE SEKISUI CHEMICAL CO., LTD. (JP) 2010-11-25 US disclosed
US-20100130697-A1 Thermosetting Resin Composition NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2010-05-27 US disclosed
US-20100130697-A1 Thermosetting Resin Composition NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2010-05-27 US disclosed
CN-100474062-C Radiation sensitive resin composition for forming microlens JSR CORP (JP) 2009-04-01 CN disclosed
EP-2011789-A1 Compositions containing oxetane compounds for use in semiconductor packaging NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2009-01-07 EP disclosed
US-7230055-B2 Compositions containing oxetane compounds for use in semiconductor packaging NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-06-12 US disclosed
US-7230055-B2 Compositions containing oxetane compounds for use in semiconductor packaging NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-06-12 US disclosed
CN-1743913-A Radiation sensitive resin composition for forming microlens JSR CORP (JP) 2006-03-08 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR TSHR 3214/4885MEN1 4037/4885KMT2A 668/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.