SCHEMBL6865759

SCHEMBL6865759

CCOC(CC)OC=Cc1ccc(CC(C)(C)Oc2ccc(C=CC=Cc3ccc(O)cc3)cc2)cc1

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
STAT3 P40763 1/20 0.33
APP P05067 1/20 0.33
PPARG P37231 2/20 0.32
PPARA Q07869 2/20 0.32
MAOB P27338 1/20 0.32
ABCG2 Q9UNQ0 1/20 0.32
ESR1 P03372 2/20 0.31
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA7 P43166 1/20 0.31
CA9 Q16790 1/20 0.31
CA14 Q9ULX7 1/20 0.31
CTSK P43235 1/20 0.31
CHRNB2 P17787 1/20 0.31
CHRNB4 P30926 1/20 0.31
CHRNA3 P32297 1/20 0.31
CHRNA7 P36544 1/20 0.31
CHRNA4 P43681 1/20 0.31
ESR2 Q92731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6873848 0.88 APP (0.33) STAT3APPPPARGPPARAMAOB
SCHEMBL5676024 0.86 CTSK (0.36) STAT3MAOBABCG2CA12CA1
SCHEMBL6865296 0.86 PPARG (0.31) PPARGPPARACTSK
SCHEMBL6875173 0.82 STAT3 (0.37) STAT3APPPPARGPPARAMAOB
SCHEMBL4966706 0.81 PPARG (0.32) PPARGPPARA
SCHEMBL6863104 0.75 STAT3 (0.30) STAT3PPARGPPARA
SCHEMBL5676063 0.75 STAT3 (0.34) STAT3PPARGPPARAMAOBABCG2
SCHEMBL7269907 0.75 PPARG (0.31) PPARGPPARACTSK
SCHEMBL4964002 0.74 APP (0.46) STAT3APPMAOBABCG2CA12
SCHEMBL7263302 0.74 PPARG (0.33) PPARGPPARACTSK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6716573-B2 Resist Composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-6586152-B1 Useful as an ingredient of a resist composition used for preparation of semiconductor devices and the like, which comprises a compound shown by the following general formula useful as an ingredient of a resist composition used for WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-07-01 US disclosed
US-20030039920-A1 Resist composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-27 US disclosed
US-6432608-B1 FINENESS PATTERN WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2002-08-13 US disclosed