Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA2A | P29274 | 1/20 | 0.38 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | CCR1 | P32246 | 1/20 | 0.32 |
| ▸ | CCR5 | P51681 | 1/20 | 0.32 |
| ▸ | CCR8 | P51685 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30570890 | 1.00 | ADORA2A (0.38) | ADORA2ASLC6A2HTTCCR1CCR5 | |
| SCHEMBL5425440 | 0.77 | ADORA2A (0.40) | ADORA2ACCR1CCR5CCR8 | |
| SCHEMBL30361253 | 0.77 | ADORA2A (0.40) | ADORA2A | |
| SCHEMBL321932 | 0.77 | ADORA2A (0.40) | ADORA2A | |
| SCHEMBL25966831 | 0.76 | ADORA2A (0.39) | ADORA2ACCR1CCR5CCR8 | |
| SCHEMBL28017468 | 0.75 | ALDH1A1 (0.37) | — | |
| SCHEMBL9679869 | 0.74 | ADORA2A (0.38) | ADORA2A | |
| SCHEMBL3108314 | 0.74 | ADORA2A (0.38) | ADORA2ACCR1CCR5CCR8 | |
| SCHEMBL22055303 | 0.74 | ADORA2A (0.63) | ADORA2ACCR1CCR5CCR8 | |
| Pterine SCHEMBL4364328 | 0.74 | ADORA2A (0.63) | ADORA2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5385990-A | Blend of epoxy compound, amine hardener and hydroxy substituted aromatic compound | LORD CORPORATION (US) | 1995-01-31 | — | — | US | claimed |
| CN-1087367-A | Structural adhesive composition with high temperature resistance | LORD CORP (US) | 1994-06-01 | — | — | CN | claimed |
| EP-0596622-A2 | Epoxy resin structural adhesive composition having high temperature resistance | LORD CORPORATION (US) | 1994-05-11 | — | — | EP | claimed |
| CN-109557764-B | Chemically amplified positive photosensitive resin composition, resist pattern, method for forming the same, and electronic device | 奇美实业股份有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-104423170-B | Photosensitive polysiloxane composition, protective film and assembly with protective film | 奇美实业股份有限公司 | 2019-05-24 | — | — | CN | disclosed |
| CN-109557764-A | Chemically amplified positive photosensitive resin composition, resist pattern and method for forming the same, and electronic device | 奇美实业股份有限公司 | 2019-04-02 | — | — | CN | disclosed |
| CN-106933034-A | Positive light anti-etching agent composition | 东京应化工业株式会社 | 2017-07-07 | — | — | CN | disclosed |
| CN-104807994-B | Label-free thrombin detection method based on abasic sites | 大连理工大学 | 2016-08-24 | — | — | CN | disclosed |
| US-9389509-B2 | Photosensitive polysiloxane composition, protecting film and element having the protecting film | CHI MEI CORPORATION (TW) | 2016-07-12 | — | — | US | disclosed |
| US-20150346601-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE PROTECTIVE FILM | CHI MEI CORPORATION (TW) | 2015-12-03 | — | — | US | disclosed |
| US-20150234275-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM AND ELEMENT HAVING THE PROTECTING FILM | CHI MEI CORPORATION (TW) | 2015-08-20 | — | — | US | disclosed |
| EP-1644426-A1 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-12 | — | — | EP | disclosed |
| EP-1644427-A2 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-12 | — | — | EP | disclosed |
| WO-2005029184-A2 | POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-03-31 | — | — | WO | disclosed |
| WO-2005007718-A1 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-27 | — | — | WO | disclosed |
| WO-2005007719-A2 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-27 | — | — | WO | disclosed |
| CN-1067096-C | Structural adhesive composition having high temperature resistance | LORD CORP (US) | 2001-06-13 | — | — | CN | disclosed |
| US-5385990-A | Blend of epoxy compound, amine hardener and hydroxy substituted aromatic compound | LORD CORPORATION (US) | 1995-01-31 | — | — | US | disclosed |
| CN-1087367-A | Structural adhesive composition with high temperature resistance | LORD CORP (US) | 1994-06-01 | — | — | CN | disclosed |
| EP-0596622-A2 | Epoxy resin structural adhesive composition having high temperature resistance | LORD CORPORATION (US) | 1994-05-11 | — | — | EP | disclosed |