Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP4 | P27487 | 1/20 | 0.39 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.39 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.39 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.34 |
| ▸ | HTR7 | P34969 | 3/20 | 0.33 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.33 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.33 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | DRD2 | P14416 | 1/20 | 0.33 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.33 |
| ▸ | CYP26A1 | O43174 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methylamine SCHEMBL27513735 | 0.97 | DPP4 (0.41) | DPP4PDCD1CD274FOLH1TDP1 | |
| SCHEMBL27614989 | 0.86 | DPP4 (0.48) | DPP4PDCD1CD274FOLH1TDP1 | |
| Hydrogen Sulfide SCHEMBL27879825 | 0.84 | DPP4 (0.47) | DPP4PDCD1CD274FOLH1TDP1 | |
| Ammonia Solution, Strong SCHEMBL28371571 | 0.84 | DPP4 (0.47) | DPP4PDCD1CD274FOLH1TDP1 | |
| SCHEMBL2778676 | 0.82 | ALDH1A1 (0.39) | TDP1KMT2AALDH1A1SMN1; SMN2CHRM2 | |
| SCHEMBL2675606 | 0.78 | TDP1 (0.41) | DPP4TDP1KMT2AALDH1A1LMNA | |
| SCHEMBL16760960 | 0.76 | — | — | |
| SCHEMBL6480647 | 0.75 | TDP1 (0.45) | TDP1KMT2AALDH1A1LMNASMN1; SMN2 | |
| SCHEMBL29826970 | 0.75 | TDP1 (0.45) | TDP1KMT2AALDH1A1LMNASMN1; SMN2 | |
| Ammonia Solution, Strong SCHEMBL1411992 | 0.75 | ALDH1A1 (0.35) | TDP1ALDH1A1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122029623-A | Conductive paste, and laminated ceramic electronic component provided with external electrode formed using same | 纳美仕有限公司 | 2026-05-12 | — | — | CN | disclosed |
| WO-2025105465-A1 | CONDUCTIVE PASTE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE FORMED USING SAME | ナミックス株式会社 | 2025-05-22 | — | — | WO | disclosed |
| US-20250119078-A1 | LAMINATE AND ELECTROSTATIC CHUCK DEVICE | TOMOEGAWA CORPORATION (JP) | 2025-04-10 | — | — | US | disclosed |
| US-20250069936-A1 | ELECTROSTATIC CHUCK DEVICE | TOMOEGAWA CORP (JP) | 2025-02-27 | — | — | US | disclosed |
| US-12217994-B2 | Electrostatic chuck device and sleeve for electrostatic chuck device | TOMOEGAWA CORPORATION (JP) | 2025-02-04 | — | — | US | disclosed |
| US-12176237-B2 | Electrostatic chuck device | TOMOEGAWA CORPORATION (JP) | 2024-12-24 | — | — | US | disclosed |
| CN-113228495-B | Electrostatic chuck device | 巴川集团股份有限公司 | 2024-11-29 | — | — | CN | disclosed |
| CN-118919476-A | Electrostatic chuck device | 巴川集团股份有限公司 | 2024-11-08 | — | — | CN | disclosed |
| CN-118919477-A | Electrostatic chuck device | 巴川集团股份有限公司 | 2024-11-08 | — | — | CN | disclosed |
| CN-118574723-A | Laminate and electrostatic chuck device | 巴川集团股份有限公司 | 2024-08-30 | — | — | CN | disclosed |
| CN-1997682-A | Resin composition for semiconductor encapsulation and semiconductor device | SUMITOMO BAKELITE CO (JP) | 2007-07-11 | — | — | CN | disclosed |
| CN-1303175-C | Conductive adhesive and circuit comprising same | NAMICS CORP (JP) | 2007-03-07 | — | — | CN | disclosed |
| US-20060044098-A1 | Electronic part with external electrode | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2006-03-02 | — | — | US | disclosed |
| US-20050230667-A1 | Conductive adhesive and circuit using the same | SUGANUMA, KATSUAKI (JP) | 2005-10-20 | — | — | US | disclosed |
| EP-1571680-A1 | ELECTRONIC PART WITH EXTERNAL ELECTRODE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-09-07 | — | — | EP | disclosed |
| CN-1665899-A | Conductive adhesive and circuit comprising same | NAMICS CORP (JP) | 2005-09-07 | — | — | CN | disclosed |
| EP-1541654-A1 | CONDUCTIVE ADHESIVE AND CIRCUIT COMPRISING IT | Namics Corporation (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-6498200-B1 | OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM | NAMICS CORPORATION (JP) | 2002-12-24 | — | — | US | disclosed |
| US-6473288-B2 | Adhesive sheet and electrostatic chucking device | TOMOEGAWA PAPER CO. (JP) | 2002-10-29 | — | — | US | disclosed |
| US-20020004134-A1 | Adhesive sheet and electrostatic chucking device | TOMOEGAWA PAPER CO., LTD. | 2002-01-10 | — | — | US | disclosed |