SCHEMBL688181

SCHEMBL688181

Nc1cc(O)c2ccccc2c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NQO2 P16083 1/20 0.61
PLAU P00749 1/20 0.61
TRPM4 Q8TD43 1/20 0.58
CYP1A2 P05177 1/20 0.50
CTDSP1 Q9GZU7 1/20 0.45
ALDH1A1 P00352 3/20 0.44
HSD17B10 Q99714 3/20 0.44
CYP3A4 P08684 2/20 0.44
PTPN1 P18031 1/20 0.44
HIF1A Q16665 2/20 0.43
ALOX15 P16050 1/20 0.43
CASP1 P29466 1/20 0.43
CASP7 P55210 1/20 0.43
HBB P68871 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALOX5 P09917 1/20 0.42
CASP6 P55212 2/20 0.42
NSD2 O96028 1/20 0.42
DUSP3 P51452 1/20 0.42
PTPN5 P54829 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31110337 1.00 NQO2 (0.61) NQO2PLAUTRPM4CYP1A2CTDSP1
SCHEMBL8196720 0.76 NQO2 (0.67) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL7218852 0.76 ALDH1A1 (0.48) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL28681 0.76 NQO2 (1.00) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL29351048 0.76 NQO2 (1.00) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL5147716 0.76 NQO2 (1.00) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL29487594 0.76 ALDH1A1 (0.54) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL2153752 0.76 ALDH1A1 (0.54) NQO2PLAUTRPM4CYP1A2ALDH1A1
SCHEMBL588930 0.76 PLAU (1.00) NQO2PLAUCYP1A2CTDSP1ALDH1A1
SCHEMBL30334777 0.76 PLAU (1.00) NQO2PLAUCYP1A2CTDSP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 239 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119781246-A Photosensitive polyimide resin composition, cured film, and preparation method and application thereof 吉林奥来德光电材料股份有限公司 2025-04-08 CN claimed
CN-115010924-B Photosensitive polyimide resin composition, polyimide resin film containing photosensitive polyimide resin composition and application of photosensitive polyimide resin composition 吉林奥来德光电材料股份有限公司 2023-10-13 CN claimed
CN-115010924-A Photosensitive polyimide resin composition, polyimide resin film containing same and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2022-09-06 CN claimed
CN-111766727-A Polyimide substrate for flexible liquid crystal display and preparation method thereof 浙江中科玖源新材料有限公司 2020-10-13 CN claimed
CN-106810695-B A kind of aromatic polyesterimides and preparation method thereof 苏州大学 2019-09-06 CN claimed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
CN-106810695-A A kind of aromatic polyesterimides and preparation method thereof 苏州大学 2017-06-09 CN claimed
US-20090240033-A1 AFFINITY MATRIX LIBRARY AND ITS USE LI RONGXIU 2009-09-24 US claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
US-4960860-A POLYIMIDES HARDNER FOR EPXOY RESINS FOR LAMINATION AND MOLDING SUMITOMO CHEMICAL CO., LTD. (JP) 1990-10-02 US disclosed
US-4888407-A Imide compound and composition containing the same SUMITOMO CHEMICAL CO., LTD. (JP) 1989-12-19 US disclosed
US-4794148-A POLYIMIDE-EPOXY RESIN BLEND SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-12-27 US disclosed
EP-0277742-A2 Fiber-reinforced composite material SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-08-10 EP disclosed
EP-0273731-A1 Imide compound and composition containing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-07-06 EP disclosed
US-4176134-A A CHEMICAL INTERMEDIATE FOR CYAN-DYE RELEASING REDOX COMPOUNDS FUJI PHOTO FILM CO., LTD. (JP) 1979-11-27 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR NQO2 1310/4885PLAU 3173/4885TRPM4 3336/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 NQO2 4690/4885PLAU 1440/4885TRPM4 391/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.