Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | GMNN | O75496 | 1/20 | 0.35 |
| ▸ | PPM1B | O75688 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.35 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | PPP5C | P53041 | 1/20 | 0.35 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.35 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.35 |
| ▸ | THPO | P40225 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19205867 | 0.71 | — | — | |
| SCHEMBL5394916 | 0.71 | — | — | |
| SCHEMBL5394783 | 0.71 | — | — | |
| SCHEMBL13216620 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL27496 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL10050519 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL13897083 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL13957069 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL3130301 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL533614 | 0.70 | ALDH1A1 (0.48) | KDM4EGMNNPPM1BLMNAPPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040260039-A1 | Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin | MITSUI CHEMICALS, INC. (JP) | 2004-12-23 | — | — | US | disclosed |