SCHEMBL6883556

SCHEMBL6883556

CC(C(N)=O)=C(C(C)(C)C)C(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.39
ALOX15 P16050 1/20 0.39
BLM P54132 1/20 0.39
PMP22 Q01453 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
LDHA P00338 1/20 0.30
LDHB P07195 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27696587 0.73 LMNA (0.58) LMNAALOX15BLMPMP22TDP1
SCHEMBL4141273 0.73 LMNA (0.58) LMNAALOX15BLMPMP22TDP1
SCHEMBL4779556 0.73 LMNA (0.58) LMNAALOX15BLMPMP22TDP1
SCHEMBL20550221 0.73 FFAR3 (0.35)
SCHEMBL28006685 0.72 TDP1 (0.31) LMNAALOX15BLMPMP22TDP1
SCHEMBL27476647 0.70 LMNA (0.54) LMNAALOX15BLMPMP22TDP1
SCHEMBL11464126 0.67
SCHEMBL3360476 0.67
SCHEMBL17241077 0.67
SCHEMBL15605 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110462797-B Polishing composition 福吉米株式会社 2023-09-22 CN disclosed
CN-110998800-B Polishing liquid, polishing liquid set and polishing method 株式会社力森诺科 2023-09-22 CN disclosed
CN-106463386-B Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2020-12-01 CN disclosed
CN-111433311-A Polishing liquid, polishing liquid set, polishing method, and defect suppression method 日立化成株式会社 2020-07-17 CN disclosed
CN-111040731-A Composition for polishing silicon wafer 福吉米株式会社 2020-04-21 CN disclosed
CN-110998800-A Polishing liquid, polishing liquid set and polishing method 日立化成株式会社 2020-04-10 CN disclosed
CN-106233424-B Silicon Wafer composition for polishing 福吉米株式会社 2018-12-25 CN disclosed
CN-104471339-B Carry efficient energy regenerating ventilation core 科腾聚合物美国有限责任公司 2018-10-12 CN disclosed
CN-103906808-B Polyoxyalkyleneamine modified sulfonated block copolymers, their preparation and their use 科腾聚合物美国有限责任公司 2017-01-18 CN disclosed
CN-106233424-A Silicon Wafer composition for polishing 福吉米株式会社 2016-12-14 CN disclosed
CN-100377310-C CMP polishing compound and polishing method HITACHI CHEMICAL CO LTD (JP) 2008-03-26 CN disclosed
CN-1278853-C Image recording material FUJI PHOTO FILM CO LTD (JP) 2006-10-11 CN disclosed
CN-1745460-A CMP polishing slurry and polishing method HITACHI CHEMICAL CO LTD (JP) 2006-03-08 CN disclosed
CN-1495524-A Polymeric composition and lithographic printing platemaking forebody 富士胶片株式会社 2004-05-12 CN disclosed
EP-1389521-A2 Thermosensitive/photosensitive resin composition Fuji Photo Film Co., Ltd. (JP) 2004-02-18 EP disclosed
CN-1406747-A Image recording material FUJI PHOTO FILM CO LTD (JP) 2003-04-02 CN disclosed
EP-0758361-B1 POLYMERISABLE COMPOSITION AND THE USE THEREOF NOVARTIS AG (CH) 2000-11-15 EP disclosed
US-5852126-A Polymerisable composition and the use thereof NOVARTIS AG (CH) 1998-12-22 US disclosed
EP-0758361-A1 POLYMERISABLE COMPOSITON AND THE USE THEREOF Novartis AG (CH) 1997-02-19 EP disclosed
WO-1995029959-A1 POLYMERISABLE COMPOSITON AND THE USE THEREOF CIBA-GEIGY AG (CH) 1995-11-09 WO disclosed