SCHEMBL6884318

SCHEMBL6884318

COc1c(C)c(OC)c(OC)c(P(c2c(OC)c(OC)c(C)c(OC)c2OC)c2c(OC)c(OC)c(C)c(OC)c2OC)c1OC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6884221 0.88 ACHE (0.31) ACHE
SCHEMBL6884526 0.84 KDM4E (0.32)
SCHEMBL6881912 0.82 ACHE (0.31) ACHE
SCHEMBL6883720 0.78
SCHEMBL16785663 0.77 ACHE (0.38) ACHE
SCHEMBL2494937 0.74 ACHE (0.36) ACHE
SCHEMBL11308950 0.73 ACHE (0.40) ACHE
SCHEMBL14507695 0.71 ACHE (0.35) ACHE
SCHEMBL14217694 0.70 ACHE (0.38) ACHE
SCHEMBL2495732 0.67 ACHE (0.36) ACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed