SCHEMBL688446

SCHEMBL688446

[CH2]C(=O)/C=C/C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6547948 1.00
SCHEMBL688447 1.00
SCHEMBL4312931 0.72
SCHEMBL10981310 0.69 KEAP1 (0.32)
SCHEMBL2589699 0.69
SCHEMBL14599339 0.69
SCHEMBL27918599 0.69 KEAP1 (0.32)
SCHEMBL182830 0.69
Crotonic Acid SCHEMBL7197879 0.69
Crotonic Acid SCHEMBL7197870 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
EP-1970761-B1 Photosensitive composition and method of producing a cured relief pattern FUJIFILM CORP (JP) 2012-02-29 EP disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed
EP-1970761-A1 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM Corporation (JP) 2008-09-17 EP disclosed
US-7022456-B2 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 2006-04-04 US disclosed
US-6743562-B2 ACID GENERATORS; FOR THE PRODUCTION OF SEMICONDUCTOR INTEGRATED CIRCUITS, PHOTORESISTS FUJI PHOTO FILM CO., LTD. (JP) 2004-06-01 US disclosed
US-20040048190-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. 2004-03-11 US disclosed
US-20020172886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. 2002-11-21 US disclosed