Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTPN1 | P18031 | 1/20 | 0.32 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.32 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.32 |
| ▸ | FABP7 | O15540 | 1/20 | 0.32 |
| ▸ | FABP3 | P05413 | 1/20 | 0.32 |
| ▸ | FABP5 | Q01469 | 1/20 | 0.32 |
| ▸ | CASP1 | P29466 | 1/20 | 0.32 |
| ▸ | RECQL | P46063 | 1/20 | 0.32 |
| ▸ | CA12 | O43570 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | CA9 | Q16790 | 1/20 | 0.31 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | HPGD | P15428 | 2/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.31 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.31 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11689202 | 0.87 | CD44 (0.42) | PTPN1PTPN6PTPN11CYP3A4CASP1 | |
| SCHEMBL30089434 | 0.87 | CD44 (0.42) | PTPN1PTPN6PTPN11CYP3A4CASP1 | |
| SCHEMBL31081959 | 0.85 | TSHR (0.39) | CASP1ALDH1A1HPGDHSD17B10KDM4E | |
| SCHEMBL17675409 | 0.83 | TAAR1 (0.32) | PTPN1PTPN6PTPN11SMN1; SMN2 | |
| SCHEMBL29137850 | 0.83 | CD44 (0.50) | CYP3A4CA1CA2CA9ALDH1A1 | |
| SCHEMBL15750700 | 0.81 | PTPN1 (0.34) | PTPN1PTPN6PTPN11 | |
| SCHEMBL11193381 | 0.78 | G6PD (0.38) | CYP3A4RECQLCA1CA2ALDH1A1 | |
| SCHEMBL28182548 | 0.78 | ALDH1A1 (0.43) | CYP3A4CA12CA1CA2CA9 | |
| SCHEMBL28025590 | 0.76 | G6PD (0.55) | FABP7FABP3FABP5RECQLCA12 | |
| SCHEMBL18825129 | 0.75 | TDP1 (0.45) | PTPN11CYP3A4ALDH1A1HSD17B10MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| US-20250068070-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-27 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| EP-1662319-A2 | Photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2006-05-31 | — | — | EP | disclosed |
| US-20060110680-A1 | Photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2006-05-25 | — | — | US | disclosed |
| US-20050202337-A1 | Photosensitive resin composition and method for preparing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2005-09-15 | — | — | US | disclosed |
| US-6887643-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-05-03 | — | — | US | disclosed |
| EP-1508837-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES, INC. (JP) | 2005-02-23 | — | — | EP | disclosed |
| US-20050014876-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-20 | — | — | US | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | PTPN1 2077/4885PTPN6 2209/4885PTPN11 2026/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | PTPN1 923/4885PTPN6 1500/4885PTPN11 1294/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.