Phosphoric Acid

Phosphoric Acid

SCHEMBL6886898

C=CC(=O)OCCOC(=O)C=C.O=P(O)(O)O

nearest known ligand 0.70

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.70
ALDH1A1 P00352 4/20 0.70
TP53 P04637 3/20 0.70
HIF1A Q16665 3/20 0.70
HSD17B10 Q99714 1/20 0.70
CYP3A4 P08684 2/20 0.62
HPGD P15428 1/20 0.56
THRB P10828 4/20 0.50
MAPK1 P28482 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
LPAR2 Q9HBW0 1/20 0.33
LPAR3 Q9UBY5 1/20 0.33
ATM Q13315 1/20 0.33
HCAR2 Q8TDS4 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phosphoric Acid SCHEMBL2326265 0.93 TSHR (0.68) TSHRALDH1A1TP53HIF1AHSD17B10
Phosphoric Acid SCHEMBL28250507 0.91 TSHR (0.59) TSHRALDH1A1TP53HIF1AHSD17B10
Phosphoric Acid SCHEMBL7553042 0.91 TSHR (0.71) TSHRALDH1A1TP53HIF1AHSD17B10
Phosphoric Acid SCHEMBL7552988 0.91 TSHR (0.78) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL30604742 0.89 TSHR (0.84) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL93462 0.89 TSHR (0.84) TSHRALDH1A1TP53HIF1AHSD17B10
Phosphoric Acid SCHEMBL1170254 0.89 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
Phosphoric Acid SCHEMBL28332285 0.89 TSHR (0.56) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL900042 0.87 TSHR (0.80) TSHRALDH1A1TP53HIF1AHSD17B10
Ethylene SCHEMBL1165263 0.87 TSHR (0.80) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-54053145-A None JP disclosed
EP-4394509-A1 PHOTOSENSITIVE COMPOSITION FOR PATTERN FORMATION, AND FLEXOGRAPHIC PLATE Zeon Corporation (JP) 2024-07-03 EP disclosed
WO-2023026928-A1 PHOTOSENSITIVE COMPOSITION FOR PATTERN FORMATION, AND FLEXOGRAPHIC PLATE 日本ゼオン株式会社 2023-03-02 WO disclosed
CN-107111235-B Protective film for dry film resist and photosensitive resin laminate 三菱化学株式会社 2020-11-10 CN disclosed
EP-3478755-A1 PHOSPHONATE MODIFIED METAL OXIDE PARTICLE Dow Global Technologies, LLC (US) 2019-05-08 EP disclosed
WO-2018000295-A1 PHOSPHONATE MODIFIED METAL OXIDE PARTICLE DOW GLOBAL TECHNOLOGIES LLC (US) 2018-01-04 WO disclosed
US-6818382-B2 PHOTOCURABLE URETHANE (METH)ACRYLATE COMPOUND HAVING A CARBOXYL GROUP, A THERMOSETTING RESIN, PHOTOPOLYMERIZATION INITIATOR AND A THERMO POLYMERIZATION CATALYST SHOWA DENKO K.K. (JP) 2004-11-16 US disclosed
EP-1317691-A2 PHOTOSENSITIVE COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME Showa Denko K.K. (JP) 2003-06-11 EP disclosed
US-20030003398-A1 Photosensitive composition, cured article thereof, and printed circuit board using the same SHOWA DENKO K.K. (JP) 2003-01-02 US disclosed
EP-0740214-B1 Photosensitive composition and photosensitive rubber plate ZEON CORP (JP) 2002-07-10 EP disclosed
WO-2002023273-A2 PHOTOSENSITIVE COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME SHOWA DENKO K.K. (JP) 2002-03-21 WO disclosed
US-5863704-A BLENDS OF DIENE-AROMATIC VINYL COPOLYMER BLOCKS, PHOTOPOLYMERIZABLE ETHYLENICALLY UNSATURATED MONOMER AND PHOTOINITIATOR NIPPON ZEON COMPANY, LTD. (JP) 1999-01-26 US disclosed
EP-0546814-B1 A polyimide photosensitive cover coating agent CHISSO CORP (JP) 1997-09-17 EP disclosed
EP-0740214-A2 Photosensitive composition and photosensitive rubber plate NIPPON ZEON CO., LTD. (JP) 1996-10-30 EP disclosed
EP-0410702-B1 Printing ink composition CHISSO CORP (JP) 1996-04-10 EP disclosed
US-5326792-A Protective coatings for flexibile circuits CHISSO CORPORATION (JP) 1994-07-05 US disclosed
US-5254361-A Improved adhesion, flexibility, and heat resistance, mixture of solvent, polyamide-acid, and partially imidized polyamide-acid, heating to dry and cure CHISSO CORPORATION (JP) 1993-10-19 US disclosed
EP-0546814-A1 A polyimide photosensitive cover coating agent CHISSO CORPORATION (JP) 1993-06-16 EP disclosed
EP-0410702-A2 Printing ink composition Chisso Corporation (JP) 1991-01-30 EP disclosed
JP-S5453145-A RESIN COMPOSITION FOR COATING HITACHI CHEM CO LTD 1979-04-26 JP disclosed