SCHEMBL6889837

SCHEMBL6889837

C=C(C[Si](OC)(OC)OC)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TET2 Q6N021 4/20 0.35
TET3 O43151 1/20 0.33
TET1 Q8NFU7 1/20 0.33
GRIK1 P39086 1/20 0.32
GRIK2 Q13002 1/20 0.32
GRM1 Q13255 1/20 0.32
GRM2 Q14416 1/20 0.32
ALOX15 P16050 1/20 0.32
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3503866 0.79 ALDH1A1 (0.42) TET2
SCHEMBL23455660 0.77 TET2 (0.33) TET2TET3TET1GRIK1GRIK2
SCHEMBL3502257 0.77 TET2 (0.33) TET2TET3TET1GRIK1GRIK2
SCHEMBL23413448 0.77 TET2 (0.33) TET2TET3TET1GRIK1GRIK2
SCHEMBL691967 0.74 TBXAS1 (0.36) TET2
SCHEMBL1448792 0.74 FFAR3 (0.35)
SCHEMBL15364753 0.73 FNTA (0.39)
SCHEMBL8414115 0.73 TBXAS1 (0.35) TET2
SCHEMBL111603 0.73 TBXAS1 (0.38) TET2
SCHEMBL447743 0.72 TET2 (0.39) TET2TET3TET1GRIK1GRIK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2015138162-A1 COATING COMPOSITIONS COMPRISING FUNCTIONALIZED HOLLOW SILICA PARTICLES WITH LOW POROSITY PREPARED USING WATER-BASED SILICA PRECURSORS E I DU PONT DE NEMOURS AND COMPANY (US) 2015-09-17 WO disclosed
US-8883314-B2 Coated articles with improved fingerprint resistance and methods of making same CORNING INCORPORATED (US) 2014-11-11 US disclosed
US-20120189843-A1 Coated Articles With Improved Fingerprint Resistance and Methods of Making Same CORNING INCORPORATED 2012-07-26 US disclosed
WO-2004107477-A2 CONDUCTIVE MEMBRANES FORMED FROM SILANES HAVING FUNCTIONAL GROUPS TOYOTA TECHNICAL CENTER USA, INC. (US) 2004-12-09 WO disclosed
EP-0781639-B1 A mold of a photocured resin containing a reinforcing agent TEIJIN SEIKI CO LTD (JP) 2003-03-26 EP disclosed
US-6003832-A Mold of a photocured resin containing a reinforcing agent TEIJIN SEIKI CO., LTD. (JP) 1999-12-21 US disclosed
US-5679722-A A LIQUID PHOTOCURABLE RESIN, A REINFORCING AGENT SELECTED FROM INORGANIC SOLID PARTICLES OR WHISKERS HAVING SPECIFIC PARTICLE DIAMETER TEIJIN SEIKI CO., LTD. (JP) 1997-10-21 US disclosed
EP-0781639-A2 A mold of a photocured resin containing a reinforcing agent Teijin Seiki Co., Ltd. (JP) 1997-07-02 EP disclosed