SCHEMBL6902834

SCHEMBL6902834

CC(C)(c1ccc(N)c(N)c1Oc1ccccc1)c1ccc(N)c(N)c1Oc1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.38
LTA4H P09960 4/20 0.37
TSHR P16473 1/20 0.37
MAOB P27338 1/20 0.35
KMT2A Q03164 4/20 0.34
MAPT P10636 3/20 0.34
KDM4E B2RXH2 1/20 0.34
GLA P06280 1/20 0.34
RIPK1 Q13546 1/20 0.34
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
MEN1 O00255 3/20 0.33
POLB P06746 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
KDM1A O60341 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1966244 0.81 MAOB (0.40) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL8954705 0.79 MAOB (0.39) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL28597896 0.74 CYP1A2 (0.46) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL6048021 0.74 CYP1A2 (0.50) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL6902831 0.74 ADORA2A (0.44) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL22325979 0.73 MAOA (0.42) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL20535327 0.73 RHEB (0.47) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL30618213 0.72 CA1 (0.42) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL3272221 0.72 CA1 (0.42) MAOALTA4HTSHRMAOBKMT2A
SCHEMBL22325826 0.72 MAOA (0.38) MAOALTA4HTSHRMAOBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1114845-B1 PASTE COMPOSITION, AND PROTECTIVE FILM AND SEMICONDUCTOR DEVICE BOTH OBTAINED WITH THE SAME HITACHI CHEMICAL CO LTD (JP) 2004-07-28 EP disclosed
US-6404068-B1 (A) A THERMOPLASTIC RESIN, (B) AN EPOXY RESIN, (C) A COUPLING AGENT, (D) A POWDERY INORGANIC FILLER, (E) A POWDER HAVING RUBBER ELASTICITY AND (F) AN ORGANIC SOLVENT; LOW WATER VAPOR PERMEABILITY HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-06-11 US disclosed
EP-1114845-A1 PASTE COMPOSITION, AND PROTECTIVE FILM AND SEMICONDUCTOR DEVICE BOTH OBTAINED WITH THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-07-11 EP disclosed