Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | DNM1 | Q05193 | 7/20 | 0.38 |
| ▸ | CA12 | O43570 | 2/20 | 0.38 |
| ▸ | CA1 | P00915 | 2/20 | 0.38 |
| ▸ | CA2 | P00918 | 2/20 | 0.38 |
| ▸ | CA3 | P07451 | 2/20 | 0.38 |
| ▸ | CA4 | P22748 | 2/20 | 0.38 |
| ▸ | CA6 | P23280 | 2/20 | 0.38 |
| ▸ | CA5A | P35218 | 2/20 | 0.38 |
| ▸ | CA7 | P43166 | 2/20 | 0.38 |
| ▸ | CA9 | Q16790 | 2/20 | 0.38 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.38 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.36 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11127804 | 0.95 | LMNA (0.40) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL11127805 | 0.95 | LMNA (0.40) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL11319259 | 0.95 | LMNA (0.40) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL1507436 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL19946200 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL19468447 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL19468478 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL238797 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL19946206 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 | |
| SCHEMBL118217 | 0.87 | DNM1 (0.50) | LMNADNM1CA12CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4663374-A1 | POLYAMIDE RESIN COMPOSITION FOR INSERT MOLDING, METAL RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4663703-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| WO-2025084296-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT | 三井化学株式会社 | 2025-04-24 | — | — | WO | disclosed |
| CN-119744285-A | Polyamide resin composition, metal resin joined body, method for producing same, bus bar unit, driving unit, and moving body | 三井化学株式会社 | 2025-04-01 | — | — | CN | disclosed |
| WO-2024166903-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | 三井化学株式会社 | 2024-08-15 | — | — | WO | disclosed |
| WO-2024048508-A1 | POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT | 三井化学株式会社 | 2024-03-07 | — | — | WO | disclosed |
| EP-4130140-A1 | SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLES THEREFROM | Mitsui Chemicals, Inc. (JP) | 2023-02-08 | — | — | EP | disclosed |
| CN-115175963-A | Semi-aromatic polyamide resin composition and molded article thereof | 三井化学株式会社 | 2022-10-11 | — | — | CN | disclosed |
| EP-0864610-B1 | Semiaromatic polyamide resin composition | MITSUI CHEMICALS INC (JP) | 2004-01-21 | — | — | EP | disclosed |
| US-6319986-B1 | BLEND OF COPOLYAMIDE FROM TEREPHTHALIC ACID AND MIXTURE OF STRAIGHT-CHAIN AND BRANCH-CHAIN ALKYLENEDIAMINES; COPOLYAMIDE OF DODECANOLACTAM AND DODECANEDIOIC ACID AND DIAMINE; AND GRAFTED OLEFIN COPOLYMER | MITSUI CHEMICALS (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6117942-A | GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL | MITSUI CHEMICALS (JP) | 2000-09-12 | — | — | US | disclosed |
| EP-0864610-A1 | Semiaromatic polyamide resin composition | Mitsui Chemicals, Inc. (JP) | 1998-09-16 | — | — | EP | disclosed |