SCHEMBL6907919

SCHEMBL6907919

CCC[Si](N)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3093340 0.86
SCHEMBL4839132 0.82 LMNA (0.34)
SCHEMBL7753435 0.77
SCHEMBL27597521 0.73
SCHEMBL17962371 0.73
SCHEMBL472155 0.73
SCHEMBL2254721 0.71
SCHEMBL4943392 0.71
Methylamine SCHEMBL110166 0.69 LMNA (0.41)
SCHEMBL106800 0.67 LMNA (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11697131-B2 Method for modifying surface of polymer substrate and polymer substrate having surface modified thereby IUCF HYU ERICA CAMPUS (KR) 2023-07-11 US claimed
CN-115612397-A Impact resistant layer, method of introducing the same, and substrate comprising the impact resistant layer 东友精细化工有限公司 2023-01-17 CN claimed
CN-112500112-B Ceramic tile adhesive and ceramic tile paving method 广东博智林机器人有限公司 2021-05-14 CN claimed
CN-112500112-A Ceramic tile adhesive and ceramic tile paving method 广东博智林机器人有限公司 2021-03-16 CN claimed
CN-110982036-A High-temperature-resistant silane modified polymer and preparation method thereof 上海东大化学有限公司 2020-04-10 CN claimed
JP-8027406-A None JP disclosed
JP-9025446-A None JP disclosed
US-12174539-B2 Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-24 US disclosed
WO-2024233016-A2 COMPOSITIONS FOR FORMING POLYIMIDE COATINGS HD MICROSYSTEMS (US) 2024-11-14 WO disclosed
WO-2024203663-A1 METHOD FOR PRODUCING HOLLOW SILICA PARTICLE, AND HOLLOW SILICA PARTICLE 扶桑化学工業株式会社 2024-10-03 WO disclosed
CN-116909100-B Photosensitive polyimide precursor composition 深圳先进电子材料国际创新研究院 2024-03-19 CN disclosed
EP-3733461-B1 CLEANING DEVICE HAVING MULTI LAYER STRUCTURE AND METHOD OF OPERATING THE SAME MYONGJI UNIV INDUSTRY AND ACADEMIA COOPERATION FOUNDATION (KR) 2024-01-10 EP disclosed
US-6743843-B2 DAMPER OR INSULATOR IN ELECTRICAL APPLIANCES; RADICAL-CURABLE ACRYLOYL FUNCTIONAL GROUP ON AMINO-TERMINATED POLYSILOXANE, UNREACTIVE POLYSILOXANE, AMORPHOUS PULVERIZATION PRODUCT OF A CROSSLINKED SILICONE RESIN, ATOMIZED SILICA THREE BOND CO., LTD. (JP) 2004-06-01 US disclosed
US-20030050387-A1 Silicone gel composition THREEBOND FINE CHEMICAL CO., LTD. (JP) 2003-03-13 US disclosed
EP-1273602-A1 SILICONE GEL COMPOSITION THREE BOND CO., LTD. (JP) 2003-01-08 EP disclosed
CN-1094210-C Charging device, treating box using said device, and electronic camera thereof 2002-11-13 CN disclosed
CN-1155105-A Charging device, treating box using said device, and electronic camera thereof CANON KK (JP) 1997-07-23 CN disclosed
JP-H0925446-A UNERASABLE PENCIL LEAD MITSUBISHI PENCIL CO LTD 1997-01-28 JP disclosed
JP-H0827406-A UNERASABLE PENCIL LEAD MITSUBISHI PENCIL CO LTD 1996-01-30 JP disclosed
EP-0405494-A2 Silicone-urethane copolymers UNION CARBIDE CHEMICALS AND PLASTICS COMPANY, INC. (US) 1991-01-02 EP disclosed