SCHEMBL6913684

SCHEMBL6913684

O=S(=O)(O)c1ccc(S(=O)(=O)Oc2ccccc2)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 4/20 0.58
TSHR P16473 2/20 0.58
TDP1 Q9NUW8 3/20 0.56
POLB P06746 1/20 0.50
CYP2D6 P10635 1/20 0.50
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA9 Q16790 1/20 0.47
MAPT P10636 3/20 0.46
MEN1 O00255 1/20 0.45
KMT2A Q03164 1/20 0.45
LMNA P02545 2/20 0.45
HTT P42858 1/20 0.45
L3MBTL1 Q9Y468 1/20 0.45
ALDH1A1 P00352 2/20 0.44
MAOB P27338 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
ADAMTS4 O75173 1/20 0.43
NT5E P21589 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2065834 0.94 TDP1 (0.65) SMN1; SMN2TSHRTDP1POLBCYP2D6
SCHEMBL9073539 0.90 STS (0.53) SMN1; SMN2TSHRTDP1POLBCYP2D6
SCHEMBL9705238 0.86 TSHR (0.67) SMN1; SMN2TSHRTDP1POLBCYP2D6
SCHEMBL19146 0.85 TDP1 (0.73) SMN1; SMN2TDP1CA1CA2CA9
SCHEMBL7981247 0.85 TDP1 (0.73) SMN1; SMN2TDP1CA1CA2CA9
SCHEMBL28560984 0.85 POLB (0.72) SMN1; SMN2TSHRTDP1POLBCYP2D6
SCHEMBL4393906 0.84 TDP1 (0.56) SMN1; SMN2TDP1CA1CA2CA9
SCHEMBL28934632 0.83 TDP1 (0.70) SMN1; SMN2TDP1CA1CA2CA9
SCHEMBL1674227 0.83 TDP1 (0.70) SMN1; SMN2TDP1CA1CA2CA9
Ammonia Solution, Strong SCHEMBL28247173 0.83 TDP1 (0.70) SMN1; SMN2TDP1CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6727294-B2 RADIATION TRANSPARENT MOLDING MATERIALS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2004-04-27 US disclosed
US-20010034419-A1 Radiation transparent molding materials MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2001-10-25 US disclosed
US-5274009-A Also containing a polyalkylene oxide BAYER AKTIENGESELLSCHAFT (DE) 1993-12-28 US disclosed
US-5246495-A Material for improving the strength of cementitious material LOC SYSTEMS, LTD. (LP) (US) 1993-09-21 US disclosed