SCHEMBL692631

SCHEMBL692631

CCCCCC(N)=O.NC(=O)c1cccc(C(=O)N2Cc3cccc(c3)C2)c1

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.42
OPRD1 P41143 1/20 0.42
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
HSP90AA1 P07900 2/20 0.39
HSP90AB1 P08238 2/20 0.39
HSD17B10 Q99714 1/20 0.37
CNR2 P34972 4/20 0.37
MAP3K7 O43318 1/20 0.37
CNR1 P21554 1/20 0.37
MAPT P10636 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
PARP1 P09874 2/20 0.37
CES2 O00748 1/20 0.37
CES1 P23141 1/20 0.37
ALDH1A1 P00352 1/20 0.37
TP53 P04637 1/20 0.37
NPC1 O15118 1/20 0.37
PARP10 Q53GL7 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL692692 0.91 HSP90AA1 (0.39) OPRM1OPRD1MEN1KMT2AHSP90AA1
SCHEMBL2445561 0.89 MEN1 (0.40) MEN1KMT2AHSD17B10MAPTSMN1; SMN2
SCHEMBL874967 0.85 PARP1 (0.46) MEN1KMT2AHSD17B10MAPTSMN1; SMN2
SCHEMBL7937028 0.84 HPGD (0.53) MEN1KMT2ACNR2CNR1SMN1; SMN2
SCHEMBL4560033 0.83 MEN1 (0.43) MEN1KMT2AMAPTPARP1PARP10
SCHEMBL8848524 0.81 HPGD (0.45) MEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6903862 0.78 PARP1 (0.47) MEN1KMT2AHSD17B10MAPTSMN1; SMN2
SCHEMBL690047 0.77 HPGD (0.56) MEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL8156659 0.75 PARP10 (0.42) HSD17B10MAPTPARP1ALDH1A1PARP10
Dodecane SCHEMBL28370737 0.75 PARP1 (0.57) OPRM1OPRD1MEN1KMT2AHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1394214-B1 POLYAMIDE RESIN COMPOSITION FOR FUSE DEVICE PACIFIC ENGINEERING CORP (JP) 2012-02-29 EP disclosed
US-20060173114-A1 POLYAMIDE RESIN COMPOSITION FOR FUSE ELEMENT AND FUSE ELEMENT FUJIMOTO KOJI 2006-08-03 US disclosed
US-20040132921-A1 Polyamide resin composition for fuse element and fuse element UNITIKA LTD. (JP) 2004-07-08 US disclosed
EP-1394214-A1 POLYAMIDE RESIN COMPOSITION FOR FUSE DEVICE Pacific Engineering Corporation (JP) 2004-03-03 EP disclosed