SCHEMBL6936863

SCHEMBL6936863

CCC(C)OC(=O)c1cc(-c2ccc(C(=O)O)c(C(=O)OC(C)CC)c2)ccc1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.49
MAPT P10636 1/20 0.43
CFD P00746 1/20 0.41
SCN1A P35498 1/20 0.41
SCN2A Q99250 1/20 0.41
SCN3A Q9NY46 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.40
MCL1 Q07820 3/20 0.40
XDH P47989 1/20 0.40
SLC22A12 Q96S37 1/20 0.40
KDM4E B2RXH2 1/20 0.40
GFER P55789 1/20 0.40
KMT2A Q03164 1/20 0.40
RXFP1 Q9HBX9 1/20 0.40
CAMKK1 Q8N5S9 2/20 0.39
CAMKK2 Q96RR4 2/20 0.39
PTPN11 Q06124 1/20 0.38
HPGD P15428 1/20 0.38
ADRB1 P08588 1/20 0.37
ADRB3 P13945 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL6939321 0.98 ALDH1A1 (0.48) ALDH1A1MAPTCFDSCN1ASCN2A
SCHEMBL6936867 0.97 ALDH1A1 (0.50) ALDH1A1MAPTCFDSCN1ASCN2A
SCHEMBL18628710 0.85 ALDH1A1 (0.48) ALDH1A1MAPTSCN1ASCN2ASCN3A
SCHEMBL25047087 0.85 ALDH1A1 (0.48) ALDH1A1MAPTSCN1ASCN2ASCN3A
SCHEMBL1898131 0.84 POLB (0.50) ALDH1A1MAPTSCN1ASCN2ASCN3A
SCHEMBL2989810 0.82 ALDH1A1 (0.68) ALDH1A1MAPTSCN1ASCN2ASCN3A
SCHEMBL10612209 0.81 ALDH1A1 (0.53) ALDH1A1MAPTCFDMCL1KDM4E
SCHEMBL889774 0.80 ALDH1A1 (0.48) ALDH1A1MAPTL3MBTL1KDM4E
SCHEMBL2485771 0.79 L3MBTL1 (0.47) ALDH1A1MAPTL3MBTL1KDM4EHPGD
SCHEMBL6929510 0.78 PDCD1 (0.61) ALDH1A1MAPTMCL1KDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1028354-B1 Positive photosensitive resin composition, method of forming relief pattern, and use of a relief pattern HITACHI CHEM DUPONT MICROSYS (JP) 2003-05-02 EP disclosed
US-6340546-B1 WHICH, ON HEATING, BECOME HEAT-RESISTANT POLYIMIDE POLYMERS SUITABLE FOR SURFACE-PROTECTING FILMS, INTERLAYER INSULATING FILMS HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2002-01-22 US disclosed
EP-1028354-A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2000-08-16 EP disclosed