SCHEMBL6938706

SCHEMBL6938706

CC(C)(c1ccc2c(c1)C(=O)N(O)C2=O)c1ccc2c(c1)C(=O)N(O)C2=O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA9 Q16790 5/20 0.45
CA1 P00915 4/20 0.45
CA12 O43570 3/20 0.45
CA2 P00918 3/20 0.41
ESR1 P03372 3/20 0.39
ALDH1A1 P00352 2/20 0.39
NFKB1 P19838 2/20 0.39
NFKB2 Q00653 2/20 0.39
RELA Q04206 2/20 0.39
NPC1 O15118 1/20 0.39
PLA2G1B P04054 1/20 0.39
CASP3 P42574 1/20 0.39
RAB9A P51151 1/20 0.39
SENP8 Q96LD8 1/20 0.39
SENP7 Q9BQF6 1/20 0.39
SENP6 Q9GZR1 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
ATG4B Q9Y4P1 1/20 0.39
ESR2 Q92731 2/20 0.37
ERCC1 P07992 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10053400 0.82 ALDH1A1 (0.52) CA9CA1CA12CA2ALDH1A1
SCHEMBL28901166 0.82 MAPK1 (0.57) CA9CA1CA12CA2ALDH1A1
SCHEMBL12534812 0.82 POLB (0.49) ALDH1A1KDM4EPOLBHTTKMT2A
SCHEMBL12540883 0.78 NPC1 (0.41) CA9CA1CA12CA2ALDH1A1
SCHEMBL3822609 0.78 ESR1 (0.39) CA9CA1CA12CA2ESR1
SCHEMBL12541257 0.78 CA9 (0.43) CA9CA1CA12CA2ESR1
SCHEMBL31411903 0.74 CA9 (0.53) CA9CA1CA12CA2ALDH1A1
SCHEMBL3279383 0.74 CA9 (0.53) CA9CA1CA12CA2ALDH1A1
SCHEMBL12565089 0.73 ALDH1A1 (0.42) CA9CA1CA12CA2ALDH1A1
SCHEMBL25060901 0.73 KDM4E (0.57) ESR1ALDH1A1NFKB1NFKB2RELA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6582879-B2 Specified photo acid generating agent used in heat resistant photoresist composition which contains polyamide oligomer containing ester groups as pendant groups; minimize post-exposure baking process and post-exposure delay effect KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY (KR) 2003-06-24 US disclosed
US-20030064315-A1 Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY 2003-04-03 US disclosed