4-Vinylphenol

4-Vinylphenol

SCHEMBL6984387

C=Cc1ccc(O)cc1.OC=Cc1ccccc1

nearest known ligand 0.63

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.54
TSHR P16473 1/20 0.54
CYP3A4 P08684 2/20 0.44
HSPD1 P10809 2/20 0.44
HSPE1 P61604 2/20 0.44
KMT2A Q03164 2/20 0.44
PKM P14618 2/20 0.44
NFKB1 P19838 1/20 0.44
RAB9A P51151 1/20 0.44
NFKB2 Q00653 1/20 0.44
RELA Q04206 1/20 0.44
MEN1 O00255 1/20 0.44
ALDH2 P05091 1/20 0.44
MAPT P10636 1/20 0.44
CYP19A1 P11511 1/20 0.44
F3 P13726 1/20 0.44
MAOA P21397 1/20 0.44
MAOB P27338 1/20 0.44
CYP1B1 Q16678 1/20 0.44
TDP1 Q9NUW8 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Styrene SCHEMBL546105 0.90 ALDH1A1 (0.67) ALDH1A1TSHRCYP3A4MAPTCYP19A1
4-Vinylphenol SCHEMBL482342 0.88 ALDH1A1 (0.70) ALDH1A1TSHRCYP3A4HSPD1HSPE1
4-Vinylphenol SCHEMBL28701079 0.86 APP (0.61) ALDH1A1TSHRCYP3A4HSPD1HSPE1
Styrene SCHEMBL28469781 0.85 ALDH1A1 (0.74) ALDH1A1TSHRCYP3A4HSPD1HSPE1
Styrene SCHEMBL11761227 0.85 ALDH1A1 (0.74) ALDH1A1TSHRCYP3A4HSPD1HSPE1
Phenol SCHEMBL692666 0.83 TDP1 (0.55) ALDH1A1CYP3A4HSPD1HSPE1KMT2A
SCHEMBL9464046 0.83 ALDH1A1 (0.61) ALDH1A1TSHRCYP3A4KMT2APKM
Styrene SCHEMBL4633239 0.82 ALDH1A1 (0.56) ALDH1A1TSHRCYP3A4RAB9AMAPT
SCHEMBL5323209 0.81 LCK (0.48) ALDH1A1TSHRCYP3A4KMT2AMEN1
SCHEMBL23141164 0.81 APP (0.58) ALDH1A1CYP3A4KMT2APKMNFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6762511-B2 Thermosetting resin composition HITACHI, LTD. (JP) 2004-07-13 US disclosed
US-20010053448-A1 A thermosetting resin formulation for encapsulation of semiconductor comprising a epoxy or epoxide thermosetting resin, a silane compound having a functional group causes addition reaction with curing agent, and a curing agent SATSU YUICHI (JP) 2001-12-20 US disclosed