Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Acetic Acid Isobutyl Ester. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.44 |
| ▸ | TSHR | P16473 | 4/20 | 0.44 |
| ▸ | LMNA | P02545 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 3/20 | 0.37 |
| ▸ | USP2 | O75604 | 2/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.37 |
| ▸ | PRKCA | P17252 | 1/20 | 0.35 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | GALR3 | O60755 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acetic Acid Isobutyl Ester SCHEMBL5698773 | 0.90 | ALDH1A1 (0.52) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Acetic Acid Isobutyl Ester SCHEMBL2379796 | 0.89 | ALDH1A1 (0.47) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Ethyl Acetate SCHEMBL65476 | 0.86 | ALDH1A1 (0.58) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Acetic Acid Isobutyl Ester SCHEMBL1822918 | 0.85 | TDP1 (0.41) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Ether SCHEMBL242693 | 0.84 | ALDH1A1 (0.50) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Acetic Acid Isobutyl Ester SCHEMBL472049 | 0.84 | TSHR (0.47) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Ethyl Acetate SCHEMBL28009515 | 0.83 | ALDH1A1 (0.54) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Ethyl Acetate SCHEMBL22207671 | 0.83 | ALDH1A1 (0.54) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Acetic Acid Isobutyl Ester SCHEMBL28617664 | 0.82 | TSHR (0.48) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 | |
| Acetic Acid Isobutyl Ester SCHEMBL4494304 | 0.82 | TSHR (0.52) | ALDH1A1TSHRLMNAHSD17B10SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 198 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240228739-A1 | COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, AND CURED PRODUCT | ADEKA CORPORATION (JP) | 2024-07-11 | — | — | US | disclosed |
| CN-117413022-A | Composition, method for producing cured product, and cured product | 株式会社ADEKA | 2024-01-16 | — | — | CN | disclosed |
| WO-2023238286-A1 | PHOTOSENSITIVE RESIN COMPOSITION | ラサ工業株式会社 | 2023-12-14 | — | — | WO | disclosed |
| CN-117075425-A | Polysiloxane composition, composition for forming film, laminate, touch panel, and method for forming cured film | 阪田油墨株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-117069942-A | Polysiloxane compound, composition for forming film, laminate, touch panel, and method for forming cured film | 阪田油墨株式会社 | 2023-11-17 | — | — | CN | disclosed |
| US-11681222-B2 | Fluorine-containing polymer, purification method, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2023-06-20 | — | — | US | disclosed |
| US-11678562-B2 | Methods and systems of organic semiconducting polymers | PHILLIPS 66 COMPANY (US) | 2023-06-13 | — | — | US | disclosed |
| CN-114430767-B | Composition for forming film, laminate coated with the composition, touch panel using the laminate, and method for forming cured film | 阪田油墨株式会社 | 2023-04-28 | — | — | CN | disclosed |
| US-11600779-B2 | Methods and systems of organic semiconducting polymers | PHILLIPS 66 COMPANY (US) | 2023-03-07 | — | — | US | disclosed |
| WO-2022249879-A1 | COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, AND CURED PRODUCT | 株式会社ADEKA | 2022-12-01 | — | — | WO | disclosed |
| US-20020009668-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| US-20020009667-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1164434-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| EP-1162506-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-12 | — | — | EP | disclosed |
| US-20010041769-A1 | Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-11-15 | — | — | US | disclosed |
| EP-1142928-A1 | Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds | JSR Corporation (JP) | 2001-10-10 | — | — | EP | disclosed |
| EP-1085379-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6180316-B1 | SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS | JSR CORPORATION (JP) | 2001-01-30 | — | — | US | disclosed |
| US-6120858-A | COMPRISING AN EPOXY RESIN, A NOVOLAC RESIN, A CURING ACCELERATOR AND A TITANIUM BLACK PIGMENT | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2000-09-19 | — | — | US | disclosed |
| EP-0930541-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1999-07-21 | — | — | EP | disclosed |