SCHEMBL701448

SCHEMBL701448

Cc1ccc(C(=O)C(C)(C)N2CCOCC2)cc1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 4/20 0.70
ALDH1A1 P00352 4/20 0.70
SMN1; SMN2 Q16637 3/20 0.70
TSHR P16473 2/20 0.70
CYP2D6 P10635 1/20 0.54
LMNA P02545 4/20 0.53
HRH3 Q9Y5N1 1/20 0.49
RAB9A P51151 3/20 0.48
TP53 P04637 2/20 0.48
NPC1 O15118 1/20 0.48
PKM P14618 1/20 0.48
HTT P42858 1/20 0.47
CYP2C19 P33261 2/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2C9 P11712 1/20 0.46
AKR1C3 P42330 1/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
HPGD P15428 1/20 0.46
CYP3A4 P08684 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9679529 0.91 SMN1; SMN2 (0.72) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL28995353 0.90 SMN1; SMN2 (0.89) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL10940747 0.88 SMN1; SMN2 (0.72) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL10941442 0.88 ALDH1A1 (0.72) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL27630183 0.87 ALDH1A1 (0.70) MAPK1ALDH1A1SMN1; SMN2TSHRLMNA
SCHEMBL9291268 0.87 ALDH1A1 (0.70) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL10226378 0.85 ALDH1A1 (0.68) MAPK1ALDH1A1SMN1; SMN2TSHRCYP2D6
SCHEMBL9680425 0.85 ALDH1A1 (0.68) MAPK1ALDH1A1SMN1; SMN2TSHRLMNA
SCHEMBL2703478 0.85 ALDH1A1 (0.68) MAPK1ALDH1A1SMN1; SMN2TSHRHRH3
SCHEMBL600821 0.85 SMN1; SMN2 (0.68) MAPK1ALDH1A1SMN1; SMN2TSHRHRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 373 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114907811-A Packaging adhesive, shell and electronic equipment OPPO广东移动通信有限公司 2022-08-16 CN claimed
CN-112662303-A Highly water-resistant resin composition for optical fiber coating 露温迪克埃蒂姆有限公司 2021-04-16 CN claimed
US-6008269-A COMPRISING MICROCAPSULES WITH A TEMPERATURE-SENSITIVE COLOR CHANGE PROPERTY AND A BENZOPHENONE OR ACETOPHENONE TYPE PHOTOPOLYMERIZATION INITIATOR, WHEREIN SAID MICROCAPSULES CONTAIN NO ULTRAVIOLET ABSORBER AND SPECIFIC MEAN DIAMETER MATSUI SHIKISO CHEMICAL CO., LTD. (JP) 1999-12-28 US claimed
JP-10152638-A None JP disclosed
JP-63180942-A None JP disclosed
EP-4512835-A1 ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE Toyo Kohan Co., Ltd. (JP) 2025-02-26 EP disclosed
US-20250034308-A1 PHOTOCURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2025-01-30 US disclosed
WO-2024232159-A1 METHOD FOR MANUFACTURING LAYERED OPTICAL FILM 日東電工株式会社 2024-11-14 WO disclosed
WO-2024111188-A1 POLARIZING FILM, OPTICAL FILM, AND IMAGE DISPLAY DEVICE 日東電工株式会社 2024-05-30 WO disclosed
US-20240158553-A1 FINE RESIN PARTICLE, COATING FILM-SOFTENING AGENT, MATTING AGENT FOR PAINTS, STRESS RELIEVER FOR CURABLE RESINS, LIGHT DIFFUSER, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION SEKISUI KASEI CO., LTD. (JP) 2024-05-16 US disclosed
EP-4365916-A1 INSULATED WIRE, COIL COMPRISING INSULATED WIRE, AND CABLE Daicel Corporation (JP) 2024-05-08 EP disclosed
US-6008269-A COMPRISING MICROCAPSULES WITH A TEMPERATURE-SENSITIVE COLOR CHANGE PROPERTY AND A BENZOPHENONE OR ACETOPHENONE TYPE PHOTOPOLYMERIZATION INITIATOR, WHEREIN SAID MICROCAPSULES CONTAIN NO ULTRAVIOLET ABSORBER AND SPECIFIC MEAN DIAMETER MATSUI SHIKISO CHEMICAL CO., LTD. (JP) 1999-12-28 US disclosed
EP-0962789-A2 Anti-reflection film and display device having the same FUJI PHOTO FILM CO., LTD. (JP) 1999-12-08 EP disclosed
JP-H10152638-A THERMOCHROMIC ULTRAVIOLET-CURABLE INK COMPOSITION MATSUI SHIKISO KAGAKU KOGYOSHO:KK 1998-06-09 JP disclosed
EP-0348063-B1 THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1993-05-26 EP disclosed
US-5177171-A SULFONIC ACID GROUP-CONTAINING POLYURETHANE AND A PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-01-05 US disclosed
US-5145885-A Morpholine compound, binders CIBA-GEIGY CORPORATION (US) 1992-09-08 US disclosed
US-5053316-A THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-10-01 US disclosed
US-4992547-A Aminoaryl ketone photoinitiators CIBA-GEIGY CORPORATION (US) 1991-02-12 US disclosed
JP-S63180942-A RECORDING MEDIUM CANON INC 1988-07-26 JP disclosed