SCHEMBL701479

SCHEMBL701479

[Al].[Al].[Al].[Cu].[Cu].[Cu].[N-3].[N-3].[N-3].[N-3].[Ti+4].[Ti+4].[Ti+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL668682 0.89
SCHEMBL6301067 0.87
SCHEMBL709189 0.87
SCHEMBL570004 0.87
SCHEMBL18427899 0.75
SCHEMBL5772075 0.75
SCHEMBL3250005 0.75
SCHEMBL149910 0.75
SCHEMBL4896740 0.71
SCHEMBL16303 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8212231-B2 Resistive memory device with an air gap INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-07-03 US claimed
US-20110155991-A1 RESISTIVE MEMORY DEVICE AND FABRICATING METHOD THEREOF INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-06-30 US claimed
EP-2542499-B1 CMP PROCESS FLOW FOR MEMS CAVENDISH KINETICS INC (US) 2017-03-22 EP disclosed
CN-102858681-B For the cmp handling process of MEMS CAVENDISH KINETICS, INC. (US) 2015-11-25 CN disclosed
EP-2542499-A2 CMP PROCESS FLOW FOR MEMS Cavendish Kinetics Inc. (US) 2013-01-09 EP disclosed
US-8241990-B2 Air gap fabricating method INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-08-14 US disclosed
US-8212231-B2 Resistive memory device with an air gap INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-07-03 US disclosed
US-8124527-B2 CMP process flow for MEMS CAVENDISH KINETICS, INC. (US) 2012-02-28 US disclosed
WO-2011109231-A2 CMP PROCESS FLOW FOR MEMS CAVENDISH KINETICS, INC. (US) 2011-09-09 WO disclosed
US-20110212593-A1 CMP Process Flow for MEMS QORVO US, INC. 2011-09-01 US disclosed
US-20110156201-A1 AIR GAP FABRICATING METHOD INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-06-30 US disclosed
US-20110155991-A1 RESISTIVE MEMORY DEVICE AND FABRICATING METHOD THEREOF INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-06-30 US disclosed