Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27591380 | 0.92 | LMNA (0.34) | LMNATSHR | |
| SCHEMBL8451706 | 0.90 | TSHR (0.38) | LMNATSHR | |
| SCHEMBL3815234 | 0.90 | TSHR (0.38) | LMNATSHR | |
| SCHEMBL704704 | 0.83 | — | — | |
| SCHEMBL5833875 | 0.80 | — | — | |
| SCHEMBL13089487 | 0.80 | — | — | |
| SCHEMBL28744221 | 0.79 | LMNA (0.31) | LMNATSHR | |
| SCHEMBL23092277 | 0.77 | LMNA (0.30) | LMNA | |
| SCHEMBL5251666 | 0.77 | — | — | |
| SCHEMBL3958460 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104781363-B | Water-dispersible adhesive composition for transparent conductive layer, adhesive layer for transparent conductive layer, optical film with adhesive layer, and liquid crystal display device | 日东电工株式会社 | 2018-05-08 | — | — | CN | disclosed |
| CN-107075119-A | Method for producing siloxane resin | 株式会社钟化 | 2017-08-18 | — | — | CN | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| CN-100535054-C | Silica film forming material, silica film and preparation method thereof | FUJITSU LTD (JP) | 2009-09-02 | — | — | CN | disclosed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | disclosed |
| EP-1879234-A2 | Low temperature sol-gel silicates as dielectrics or planarization layers for thin film transistors | Air Products and Chemicals, Inc. (US) | 2008-01-16 | — | — | EP | disclosed |
| EP-1852903-A2 | Compositions for preparing materials with a low dielectric constant | Air Products and Chemicals, Inc. (US) | 2007-11-07 | — | — | EP | disclosed |
| EP-1826613-A2 | Top coat for lithography processes | Air Products and Chemicals, Inc. (US) | 2007-08-29 | — | — | EP | disclosed |
| EP-1691410-A2 | Method for defining a feature on a substrate | Air Products and Chemicals, Inc. (US) | 2006-08-16 | — | — | EP | disclosed |
| CN-1250557-C | Process for preparing alkoxysilanes | TOAGOSEI CO LTD (JP) | 2006-04-12 | — | — | CN | disclosed |
| US-7005532-B2 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| EP-1583141-A2 | Solvents and methods using same for removing silicon-containing residues from a substrate | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-10-05 | — | — | EP | disclosed |
| EP-1577935-A2 | Compositions for preparing low dielectric materials containing solvents | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-09-21 | — | — | EP | disclosed |
| US-20050020845-A1 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| CN-1555380-A | Process for preparing alkoxysilanes | 东亚合成株式会社 | 2004-12-15 | — | — | CN | disclosed |
| EP-1428828-A1 | PROCESS FOR PREPARATION OF ALKOXYSILANES | TOAGOSEI CO., LTD. (JP) | 2004-06-16 | — | — | EP | disclosed |
| EP-1376671-A1 | Compositions for preparing materials with a low dielectric constant | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-01-02 | — | — | EP | disclosed |
| WO-2003004567-A1 | HIGH THERMAL CONDUCTIVITY SPIN CASTABLE POTTING COMPOUND | LORD CORPORATION (US) | 2003-01-16 | — | — | WO | disclosed |