⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13089487 | 0.84 | — | — | |
| SCHEMBL702467 | 0.83 | LMNA (0.31) | — | |
| SCHEMBL27591380 | 0.81 | LMNA (0.34) | — | |
| SCHEMBL3815234 | 0.79 | TSHR (0.38) | — | |
| SCHEMBL8451706 | 0.79 | TSHR (0.38) | — | |
| SCHEMBL20492286 | 0.79 | — | — | |
| SCHEMBL5834141 | 0.78 | — | — | |
| SCHEMBL3341111 | 0.78 | TSHR (0.34) | — | |
| SCHEMBL13089491 | 0.78 | — | — | |
| SCHEMBL21059188 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120020643-A | Pattern forming method | 信越化学工业株式会社 | 2025-05-20 | — | — | CN | disclosed |
| CN-112526822-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2025-02-28 | — | — | CN | disclosed |
| CN-112286000-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2024-12-03 | — | — | CN | disclosed |
| CN-111856882-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2024-11-29 | — | — | CN | disclosed |
| CN-114594657-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-114660896-B | Composition for forming silicon-containing resist underlayer film, pattern forming method, and silicon compound | 信越化学工业株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-116804825-A | Composition for forming silicon-containing metal hard mask and pattern forming method | 信越化学工业株式会社 | 2023-09-26 | — | — | CN | disclosed |
| CN-111208710-B | Iodine-containing thermosetting silicon-containing material, resist underlayer film forming composition for extreme ultraviolet lithography containing the same, and pattern forming method | 信越化学工业株式会社 | 2023-08-22 | — | — | CN | disclosed |
| CN-111458980-B | Composition for forming underlayer film of silicon-containing resist and method for forming pattern | 信越化学工业株式会社 | 2023-08-11 | — | — | CN | disclosed |
| CN-101646718-B | Curable resin composition, protective film, and method for forming protective film | JSR CORP JP | 2013-04-03 | — | — | CN | disclosed |
| CN-101226329-A | Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof | JSR CORP (JP) | 2008-07-23 | — | — | CN | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| CN-1250557-C | Process for preparing alkoxysilanes | TOAGOSEI CO LTD (JP) | 2006-04-12 | — | — | CN | disclosed |
| US-7005532-B2 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-20050020845-A1 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| CN-1555380-A | Process for preparing alkoxysilanes | 东亚合成株式会社 | 2004-12-15 | — | — | CN | disclosed |
| EP-1428828-A1 | PROCESS FOR PREPARATION OF ALKOXYSILANES | TOAGOSEI CO., LTD. (JP) | 2004-06-16 | — | — | EP | disclosed |
| EP-1319052-A1 | COATING COMPOSITIONS | THE WELDING INSTITUTE (GB) | 2003-06-18 | — | — | EP | disclosed |
| WO-2003004567-A1 | HIGH THERMAL CONDUCTIVITY SPIN CASTABLE POTTING COMPOUND | LORD CORPORATION (US) | 2003-01-16 | — | — | WO | disclosed |
| WO-2002024824-A1 | COATING COMPOSITIONS | THE WELDING INSTITUTE (GB) | 2002-03-28 | — | — | WO | disclosed |