SCHEMBL7031343

SCHEMBL7031343

C[Si](C)(C[Si](C)(C)c1ccccn1)c1ccccn1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.40
KDM4E B2RXH2 1/20 0.40
CYP1A2 P05177 1/20 0.40
POLB P06746 1/20 0.40
CCR1 P32246 1/20 0.40
CCR5 P51681 1/20 0.40
CCR8 P51685 1/20 0.40
METAP1 P53582 1/20 0.40
BLM P54132 1/20 0.40
HIF1A Q16665 1/20 0.40
DOHH Q9BU89 1/20 0.40
P4HTM Q9NXG6 1/20 0.40
NPC1 O15118 4/20 0.39
RAB9A P51151 4/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
HTT P42858 1/20 0.39
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
ATM Q13315 1/20 0.37
HDAC8 Q9BY41 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7024059 0.91 LMNA (0.37) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL7027857 0.82 LMNA (0.37) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL7035341 0.82 LMNA (0.37) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL7029611 0.80 KCNA5 (0.38) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL29767661 0.79 KDM4E (0.48) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL1299154 0.79 KDM4E (0.48) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL10356611 0.77 KDM4E (0.46) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL29742195 0.77 NR1H2 (0.37) LMNAKDM4ECYP1A2POLBCCR1
SCHEMBL7032571 0.77 CYP1A2 (0.41) LMNAKDM4ECYP1A2NPC1RAB9A
SCHEMBL2328923 0.77 NR1H2 (0.37) LMNAKDM4ECYP1A2POLBCCR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11935803-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-19 US disclosed
US-11572434-B2 Curable composition, method for producing same, and article using same DAIKIN INDUSTRIES, LTD. (JP) 2023-02-07 US disclosed
EP-3286250-B1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME MERCK PATENT GMBH (DE) 2022-06-15 EP disclosed
EP-3286250-B1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME MERCK PATENT GMBH (DE) 2022-06-15 EP disclosed
US-20210277221-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-09 US disclosed
US-20210189052-A1 CURABLE COMPOSITION, METHOD FOR PRODUCING SAME, AND ARTICLE USING SAME DAIKIN INDUSTRIES, LTD. (JP) 2021-06-24 US disclosed
EP-3786200-A1 RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-03 EP disclosed
US-10875969-B2 Composition for forming coating film and method for forming coating film using same MERCK PATENT GMBH (DE) 2020-12-29 US disclosed
US-10781335-B2 Functional film DAIKIN INDUSTRIES, LTD. (JP) 2020-09-22 US disclosed
US-10731048-B2 2020-08-04 US disclosed
US-20190284431-A1 FUNCTIONAL FILM DAIKIN INDUSTRIES, LTD. (JP) 2019-09-19 US disclosed
US-20190169445-A1 SURFACE-TREATING AGENT AND ARTICLE COMPRISING LAYER FORMED FROM SURFACE-TREATING AGENT DAIKIN INDUSTRIES, LTD. (JP) 2019-06-06 US disclosed
US-20180201736-A1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME AZ ELECTRONIC MATERIALS S.À R.L. (LU) 2018-07-19 US disclosed
US-20180201736-A1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME AZ ELECTRONIC MATERIALS S.À R.L. (LU) 2018-07-19 US disclosed
WO-2016169631-A1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME AZ Electronic Materials (Luxembourg) S.à.r.l. (LU) 2016-10-27 WO disclosed
US-20030139600-A1 2-pyridylsilane, processes for producing and using the same SUMITOMO CHEMICAL CO., LTD. 2003-07-24 US disclosed
US-6548673-B1 Alkylation using transition metal complex catalyst; purified by acid/base extraction SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-04-15 US disclosed
US-6531602-B2 Desilylation of a 2-pyridylsilane to form an alcohol SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-03-11 US disclosed
US-20020165397-A1 2-Pyridylsilane, processes for producing and using the same SUMITOMO CHEMICAL CO., LTD. 2002-11-07 US disclosed
EP-1035125-A2 2-Pyridylsilane, processes for producing and using the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-09-13 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020165397-A1 2-Pyridylsilane, processes for producing and using the same H1-0, RIOK2, H1-4 LMNA 2432/4885KDM4E 825/4885CYP1A2 363/4885
US-20030139600-A1 2-pyridylsilane, processes for producing and using the same H1-0, H1-4, H1-2 LMNA 2555/4885KDM4E 903/4885CYP1A2 390/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.