SCHEMBL703456

SCHEMBL703456

CCO[SiH](CCCCc1ccccc1)OCC

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.44
MAOA P21397 1/20 0.44
SIGMAR1 Q99720 5/20 0.43
KCNH2 Q12809 2/20 0.43
CHRM2 P08172 1/20 0.43
HTR1A P08908 1/20 0.43
ADRA2A P08913 1/20 0.43
CHRM1 P11229 1/20 0.43
DRD1 P21728 1/20 0.43
SLC6A2 P23975 1/20 0.43
SLC6A4 P31645 1/20 0.43
ADRA1A P35348 1/20 0.43
OPRM1 P35372 1/20 0.43
DRD3 P35462 1/20 0.43
SLC6A3 Q01959 1/20 0.43
MAOB P27338 2/20 0.42
IDO1 P14902 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
ALOX5 P09917 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19470828 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL20483791 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL28399190 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL19470882 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL19470867 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL19470831 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL19470852 0.98 SIGMAR1 (0.46) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL707896 0.94 CHRM2 (0.44) L3MBTL1MAOASIGMAR1KCNH2CHRM2
SCHEMBL115877 0.86 TP53 (0.41) SIGMAR1KCNH2CHRM2HTR1AADRA2A
SCHEMBL706756 0.86 SIGMAR1 (0.44) L3MBTL1MAOASIGMAR1KCNH2CHRM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240270915-A1 SILICA-COATED CELLULOSE NANOFIBER MODIFIED WITH HYDROPHOBIC FUNCTIONAL GROUP AND PRESSURE SENSITIVE ADHESIVE COMPRISING THE SAME KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION (KR) 2024-08-15 US claimed
US-20240270915-A1 SILICA-COATED CELLULOSE NANOFIBER MODIFIED WITH HYDROPHOBIC FUNCTIONAL GROUP AND PRESSURE SENSITIVE ADHESIVE COMPRISING THE SAME KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION (KR) 2024-08-15 US disclosed
US-11680370-B2 Microfibrillated cellulose foams BORREGAARD AS (NO) 2023-06-20 US disclosed
EP-3601668-B1 MICROFIBRILLATED CELLULOSE FOAMS BORREGAARD AS (NO) 2022-01-19 EP disclosed
CN-107075255-B Encapsulating material composition for LED 日产化学工业株式会社 2020-05-22 CN disclosed
EP-3601668-A1 MICROFIBRILLATED CELLULOSE FOAMS Borregaard AS (NO) 2020-02-05 EP disclosed
US-20200032454-A1 MICROFIBRILLATED CELLULOSE FOAMS BORREGAARD AS (NO) 2020-01-30 US disclosed
EP-3382095-A1 MICROFIBRILLATED CELLULOSE FOAMS Borregaard AS (NO) 2018-10-03 EP disclosed
US-10066059-B2 Sealing material composition for LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-09-04 US disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
US-20140130710-A1 HYDROPHOBIC COATING AND A METHOD FOR PRODUCING HYDROPHOBIC SURFACE UPM-KYMMENE CORPORATION (FI) 2014-05-15 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed