SCHEMBL706756

SCHEMBL706756

CCCO[SiH](CCCCc1ccccc1)OCCC

nearest known ligand 0.52

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 5/20 0.44
IDO1 P14902 1/20 0.43
KCNH2 Q12809 2/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
MAOA P21397 1/20 0.41
CHRM2 P08172 1/20 0.41
HTR1A P08908 1/20 0.41
ADRA2A P08913 1/20 0.41
CHRM1 P11229 1/20 0.41
DRD1 P21728 1/20 0.41
SLC6A2 P23975 1/20 0.41
SLC6A4 P31645 1/20 0.41
ADRA1A P35348 1/20 0.41
OPRM1 P35372 1/20 0.41
DRD3 P35462 1/20 0.41
SLC6A3 Q01959 1/20 0.41
MAOB P27338 1/20 0.40
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19470877 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL19470864 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL19470841 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL20483785 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL19470826 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL19470872 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL19470819 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL20483520 0.98 SIGMAR1 (0.46) SIGMAR1IDO1KCNH2L3MBTL1MAOA
SCHEMBL702245 0.95 IDO1 (0.44) SIGMAR1IDO1KCNH2L3MBTL1CHRM2
SCHEMBL702249 0.92 KCNH2 (0.45) SIGMAR1IDO1KCNH2L3MBTL1MAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107075255-B Encapsulating material composition for LED 日产化学工业株式会社 2020-05-22 CN disclosed
US-10066059-B2 Sealing material composition for LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-09-04 US disclosed
US-20170306095-A1 SEALING MATERIAL COMPOSITION FOR LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-26 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed