SCHEMBL704305

SCHEMBL704305

F[Si](CC[Si](F)(c1ccccc1)c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.32
ESR2 Q92731 1/20 0.32
CALM1 P0DP23 1/20 0.32
ALDH1A1 P00352 2/20 0.31
IDO1 P14902 1/20 0.31
MAPT P10636 1/20 0.31
NR1H2 P55055 1/20 0.30
NR1H3 Q13133 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL708556 0.89 ALDH1A1 (0.33) ESR1ESR2ALDH1A1MAPT
SCHEMBL707200 0.89 ALDH1A1 (0.33) ESR1ESR2ALDH1A1MAPT
SCHEMBL707327 0.85 TP53 (0.35) ESR1ESR2ALDH1A1NR1H2NR1H3
SCHEMBL706161 0.82 ESR1 (0.32) ESR1ESR2CALM1ALDH1A1IDO1
SCHEMBL16061095 0.81 NR1H2 (0.40) NR1H2NR1H3
SCHEMBL28120878 0.80 ESR1 (0.31) ESR1ESR2CALM1
SCHEMBL5851851 0.79 IDH1 (0.39) ALDH1A1
SCHEMBL706959 0.78 TP53 (0.38) ESR1ESR2ALDH1A1MAPTNR1H2
SCHEMBL704398 0.77 ESR1 (0.32) ESR1ESR2CALM1ALDH1A1IDO1
SCHEMBL31620980 0.76 ATM (0.37) ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed